Duplexer filter having film bulk acoustic resonator and semiconductor package thereof

A duplexer filter comprising:

• a semiconductor substrate;
• a transmission side film bulk acoustic filter formed at an upper surface of the semiconductor substrate accordingly as a plurality of film bulk acoustic resonators are connected serially and in parallel;
• a reception side film bulk acoustic filter formed at one side of the transmission side film bulk acoustic filter accordingly as a plurality of film bulk acoustic resonators are connected serially and in parallel;
• and
• a plurality of passive elements formed at one side of the transmission side film bulk acoustic filter and the reception side film bulk acoustic filter.

A semiconductor package comprising:

• a semiconductor chip having a transmission side film bulk acoustic filter and a reception side film bulk acoustic filter formed at an upper surface of a semiconductor substrate accordingly as a plurality of film bulk acoustic resonators are connected serially and in parallel;
• a substrate provided with a ceramic body having a cavity of a certain space so that the semiconductor chip can be mounted, a ground plan formed at a bottom surface of the cavity of the ceramic body, a plurality of conductive ground vias connected to the ground plan for penetrating the ceramic body, and a plurality of signal wires formed from an outer circumference surface of the cavity of the ceramic body to a bottom surface thereof;
• a plurality of conductive wires for connecting the semiconductor chip, the ground plan, and the signal wires;
• and
• a lid for covering an upper portion of the cavity of the substrate so that the semiconductor chip and the conductive wires can be protected from the external environment.

A semiconductor package comprising:

• a semiconductor chip having a transmission side film bulk acoustic filter and a reception side film bulk acoustic filter formed at an upper surface of a semiconductor substrate accordingly as a plurality of film bulk acoustic resonators are connected serially and in parallel;
• a substrate provided with a ceramic body where the semiconductor chip is mounted, a plurality of wire patterns formed at an upper surface of the ceramic body so that the semiconductor chip can be connected thereto by a solder as a flip chip form with an overturned state, and a plurality of conductive ground vias and signal conductive vias connected to the plurality of wire patterns and penetrating the ceramic body;
• and
• a sealing layer for sealing the semiconductor chip of the upper surface of the ceramic body for protection from the external environment.

A semiconductor package comprising:

• a semiconductor chip having a transmission side film bulk acoustic filter and a reception side film bulk acoustic filter formed at an upper surface of a semiconductor substrate accordingly as a plurality of film bulk acoustic resonators are connected serially and in parallel;
• a substrate having an insulating body where the semiconductor chip is mounted and having a plurality of wire patterns formed at an upper surface of the insulating body so that the semiconductor chip can be connected thereto by a solder as a flip chip form with an overturned state;
• and
• a sealing layer for sealing the semiconductor chip of the upper surface of the insulating body for protection from the external environment.