Microelectronic device and method of its manufacture
OwnerWilliam Lane, Paul Lambkininventors
Life of this patent
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Abstract
A method of fabricating a reference microbolometer structure on a substrate comprises the steps of applying a sacrificial layer to the substrate; applying a further layer to the sacrificial layer, the further layer incorporating a temperature sensitive material; and partially removing the sacrificial layer from the substrate such that a portion of the sacrificial layer is not removed at least in a region between temperature sensitive material and the substrate. The portion of the sacrificial layer that is not removed thereby forms a body of solid material, and a path of low thermal impedance, between the temperature sensitive material and the substrate.
Claims33
A microbolometer structure formed on a substrate comprising a bridge structure over the substrate, the bridge structure incorporating a temperature sensitive material, in which at least part of a region between the bridge and the substrate is occupied by a solid material that acts as a thermally conductive pathway between the bridge and the substrate.
A microbolometer structure according to any preceding claim in which the solid material has a thickness of several am.
A microbolometer according to any preceding claim in which the sensitive material has an electrical resistance or other heat sensing property that changes with temperature.
A microbolometer according to any preceding claim in which the sensing material is disposed in a meander on the bridge structure.
A microbolometer according to any preceding claim in which solid material is entirely enclosed within a void formed between the bridge structure and the substrate.
A microbolometer according to any preceding claim in which in which the solid material substantially entirely fills the void.
A microbolometer according to any preceding claim in which the solid material is a material used as a sacrificial component during construction of structures on the substrate.
A microbolometer according to any preceding claim in which the solid material is polyimide.
A microbolometer structure formed on a substrate substantially as herein described with reference to the accompanying drawings.
A microbolometer combination including a reference microbolometer in accordance with any preceding claim and a sensitive microbolometer constructed on a common substrate, the sensitive microbolometer having a bridge structure that incorporates a temperature sensing material, in which the bridge structure of the reference microbolometer and the bridge structure of the sensitive microbolometer being spaced at similar distances from the substrate.
A method of fabricating a reference microbolometer structure on a substrate comprising:
- applying a sacrificial layer to the substrate;
- applying a further layer to the sacrificial layer, the further layer incorporating a temperature sensitive material;
- and
- partially removing the sacrificial layer from the substrate such that a portion of the sacrificial layer is not removed at least in a region between temperature sensitive material and the substrate.
A reference microbolometer substantially as described herein with reference to FIGS. 2 and 3 of the accompanying drawings.
A microbolometer combination substantially as described herein with reference to the accompanying drawings.
A method of fabricating a reference microbolometer structure on a substrate substantially as described herein with reference to the accompanying drawings.
Dependencies are inferred from the claim text.