Atomic layer-deposited LaAIO3 films for gate dielectrics
AssigneeMicron Technology, Inc.
InventorsKie Y. Ahn, Leonard Forbes
Life of this patent
Estimating the term…
Loading patent…
AssigneeMicron Technology, Inc.
InventorsKie Y. Ahn, Leonard Forbes
Estimating the term…
A dielectric film containing LaAlO3 and method of fabricating a dielectric film contained LaAlO3 produce a reliable gate dielectric having a thinner equivalent oxide thickness than attainable using SiO2. The LaAlO3 gate dielectrics formed are thermodynamically stable such that these gate dielectrics will have minimal reactions with a silicon substrate or other structures during processing. A LaAlO3 gate dielectric is formed by atomic layer deposition employing a lanthanum sequence and an aluminum sequence. A lanthanum sequence uses La(thd)3 (thd=2,2,6,6-tetramethl-3,5-heptanedione) and ozone. An aluminum sequence uses either trimethylaluminium, Al(CH3)3, or DMEAA, an adduct of alane (AlH3) and dimethylehtylamine [N(CH3)2(C2H5)], with distilled water vapor.
A electronic device comprising:
A transistor comprising:
A transistor comprising:
A memory comprising:
A memory comprising:
An information handling device comprising:
An information handling device comprising:
Dependencies are inferred from the claim text.