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US 2004/0164324 A1Published application
Electronic circuit package
AssigneeHitachi, Ltd.
InventorsNobuyasu Kanekawa, Hirokazu Ihara, Masatsugu Akiyama, Kiyoshi Kawabata, Hisayoshi Yamanaka, Tetsuya Okishima
Life of this patent
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Abstract
An electronic apparatus which includes a wiring substrate which includes wiring conductors, and a plurality of semiconductor bare chips that are formed on the wiring substrate. The semiconductor bare chips include a processor for processing data and a circuit having a checking function for detecting faults of the processor.
Claims6
An electronic apparatus comprising:
- a wiring substrate which includes wiring conductors;
- and
- a plurality of semiconductor bare chips that are formed on said wiring substrate,
- wherein said semiconductor bare chips include a processor for processing data and a circuit having a checking function for detecting faults of the processor.
1 more element
Dependencies are inferred from the claim text.