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AssigneeSimon Fraser University
InventorsDavid J. Maloney, Wai M. Lee, Paul J. Roman JR., Michael A. Fury
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The present invention involves a low-temperature, photoresist-free method of fabricating a barrier layer on a flexible substrate. An embodiment involves the conversion of a precursor into a top-surface imaging layer during a direct patterning step. Preferred precursors are formed from a metal complex comprising at least one ligand selected from the group consisting of acac, carboxylato, alkoxy, azide, carbonyl, nitrato, amine, halide, nitro, and mixtures thereof and at least one metal selected from the group consisting of Li, Al, Si, Ti, V, Cr, Mn, Fe, Ni, Co, Cu, Zn, Sr, Y, Zr, Nb, Mo, Ru, Rh, Pd, Ag, In, Sn, Ba, La, Pr, Sm, Eu, Hf, Ta, W, Re, Os, Ir, Pt, Au, Pb, Th, U, Sb, As, Ce, Mg, and mixtures thereof.
A method of forming a barrier layer on a substrate comprising the steps of:
A photoresist-free method of forming a barrier layer on a substrate, comprising the steps of:
A barrier layer for use in an organic light emitting device formed by:
Dependencies are inferred from the claim text.