Color filter configuration for a silicon wafer to be diced into photosensitive chips
AssigneeXerox Corporation
InventorsPaul A. Hosier, Thomas Grimsley, Josef E. Jedlicka
Life of this patent
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Abstract
An architecture and manufacturing method for photosensitive chips, such as used in office equipment and digital cameras, involves creating grooves between chip areas in a wafer, and then placing a light-transmissive planar layer over the main surface of the wafer. The planar layer, which may be acrylic-based, creates a substantially planar surface over both the photosites in the chip areas and the grooves. The planar layer in turn supports one or more light-transmissive filtering layers. The arrangement avoids damage to the filtering layers when the wafer is diced along the grooves.
Claims7
A method of making photosensitive chips for use in an imaging apparatus, comprising the steps of:
- providing an integrated circuit wafer, the wafer comprising a first chip area defined in a main surface of the wafer, the first chip area including structure related to a first photosite, and a groove defined in the wafer, the groove defining at least one edge of the first chip area;
- providing a light-transmissive planar layer over the main surface, the planar layer forming a planar surface substantially parallel with the main surface, the planar layer extending over the groove;
- and
- dicing the wafer along the groove.
Dependencies are inferred from the claim text.