Solder applying method and solder applying apparatus
AssigneeTECT Corporation
InventorHaruo Watanabe
Life of this patent
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Abstract
An electronic component 10 is moved along a predetermined path in a first direction D1 by a work conveying unit 16. From a second direction substantially orthogonal to the first direction, a solder material is applied, by injection, to lead terminals 11 of the electronic component by a solder supply unit 14. While the applied solder material is in a molten state, a high-temperature fluid is sprayed to the lead terminals by a fluid spray unit 15. It is desirable that the direction of spraying of the high-temperature fluid is adjustable.
Claims20
A solder applying method comprising a first step of moving a work along a predetermined path in a first direction, a second step of applying, by injection, a solder material to a predetermined area of said work from a second direction substantially orthogonal to said first direction, and a third step of spraying a high-temperature fluid to said predetermined area after said second step.
A solder applying apparatus comprising a work conveying unit for moving a work along a predetermined path in a first direction, a solder injection unit for injecting a solder material to a predetermined area of said work from a second direction substantially orthogonal to said first direction, and a fluid spray unit for spraying a high-temperature fluid to said predetermined area in a position downstream of said solder injection unit in said first direction.
Dependencies are inferred from the claim text.