Wire bonding method
AssigneeKabushiki Kaisha Shinkawa
InventorsTatsunari Mii, Hiroshi Watanabe
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Abstract
A wire bonding method including the steps of forming a bump by performing ball bonding of a ball by wire on a second conductor, raising a capillary to a height that is equal to or lower than the height of a ball portion that rises into a through-hole of the capillary during formation of the bump, moving the capillary in a direction that is opposite from the first conductor, lowering the capillary so as to form an inclined wedge on the bump, cutting the wire, performing the primary bonding on the first conductor, and making a loop with the wire with respect to the bump from the first conductor, thus performing the secondary bonding on the inclined wedge on the bump.
Claims1
A wire bonding method in which primary bonding is performed on a first conductor, and then secondary bonding is performed on a second conductor, thus wire-bonding between said first conductor and second conductor, said method comprising the sequential steps of:
- forming a bump by performing ball bonding by wire on said second conductor,
- raising a capillary to a height that is equal to or lower than a height of a ball portion that rises into a through-hole of said capillary during formation of said bump,
- moving said capillary in a direction opposite from said first conductor,
- lowering said capillary so as to form an inclined wedge on said bump,
- cutting said wire,
- performing said primary bonding on said first conductor, and
- making a loop with said wire with respect to said bump from said first conductor, thus performing said secondary bonding on said inclined wedge on said bump.
Dependencies are inferred from the claim text.