Microsuspension assemblies for direct access storage devices
AssigneeHitachi Global Storage Technologies Netherlands B.V.
InventorJeffrey S. Lille
Life of this patent
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Abstract
Embodiments include a method for forming a head suspension assembly. A spacer layer is formed in or on a silicon wafer. A transfer film including an opening defining the shape of a slider support membrane is provided, and the opening is filled with a resin material. The transfer film with the resin material therein is positioned over the silicon wafer so that at least a portion of the resin material is positioned adjacent to the spacer layer. The resin material is baked to form a glassy carbon material. The spacer layer is etched to form a trench in the silicon wafer adjacent to the glassy carbon material, and a slider is positioned on the glassy carbon material over the trench.
Claims17
A method for forming a head suspension assembly, comprising:
- forming a sacrificial layer in or on a portion of a substrate;
- forming a transfer film across the substrate;
- patterning a photoresist layer on top of the transfer film;
- transferring the image of the patterned photoresist layer through the transfer film;
- removing the patterned photoresist layer;
- and
- removing the sacrificial layer to form a cavity extending a distance into the substrate.
A method for forming a head suspension assembly, comprising:
- forming a polysilsesquioxone layer over a portion of a substrate;
- forming a photoresist layer on the polysilsesquioxone layer;
- patterning the photoresist layer;
- and
- etching the polysilsesquioxone layer using the patterned photoresist layer as a mask;
- and
- removing the patterned photoresist layer.
Dependencies are inferred from the claim text.