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US 2004/0163964 A1Published application
Circuitized substrate and method of making same
AssigneeEndicott Interconnect Technologies, Inc.
InventorsFrank D. Egitto, Voya P. Markovich, Thomas R. Miller
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Abstract
A method of making a circuitized substrate in which a commoning layer is used to form multiple, substantially vertically aligned conductive openings in a multilayered component such as a laminate interposer for coupling a chip to a printed circuit board or the like. The structure, including such a chip and circuit board is ideally suited for use within an information handling system.
Claims18
A method of making a circuitized substrate, said method comprising:
- providing a first dielectric layer;
- securing a first conductive layer to said first dielectric layer;
- forming at least one first opening within said first dielectric layer, said at least one opening extending through the entire thickness of said first dielectric layer;
- electroplating a first quantity of conductive material within said at least one first opening using said first conductive layer as a commoning layer for said electroplating;
- securing a second dielectric layer to said first dielectric layer;
- providing at least one second opening within said second dielectric layer in substantial alignment with said at least one first opening in said first dielectric layer;
- and
- electroplating a second quantity of conductive material within said at least one second opening, again using said first conductive layer as a commoning layer for said electroplating of said second quantity of conductive material.
5 more elements
Dependencies are inferred from the claim text.