Planar plating apparatus
AssigneeNovellus Systems, Inc.
InventorIsmail Emesh
Life of this patent
Estimating the term…
Abstract
An apparatus for performing an electrochemical process on a surface of a workpiece comprises a platen assembly comprising a support platen, an electrolyte distribution plate, and a first conductive layer intermediate the support platen and distribution plate and configured to be coupled to at least a first potential. A carrier is configured to carry the workpiece and position the workpiece proximate the electrolyte distribution plate. A reservoir delivers an electrolyte to the electrolyte distribution plate. At least one contact separate from the platen assembly engages a peripheral region of the workpiece for coupling the workpiece to a second potential.
Claims41
An apparatus for performing an electrochemical process on a surface of a workpiece, comprising:
- a platen assembly comprising:
- a support platen;
- an electrolyte distribution plate;
- and
- a first conductive layer configured to be coupled to a least a first potential;
- a carrier configured to carry the workpiece and position the workpiece proximate the electrolyte distribution plate;
- a reservoir for delivering an electrolyte to said electrolyte distribution plate;
- and
- at least one contact separate from said platen assembly and said carrier for engaging a peripheral region of said workpiece for coupling said workpiece to a second potential.
A platen for use in an electrochemical process, the platen comprising:
- a support plate;
- an electrolyte distribution plate atop said support plate;
- and
- a conductive layer beneath said distribution plate, said conductive layer comprised of a plurality of concentric conductive segments, each of said segments configured for coupling to a respective potential.
An apparatus for performing an electrochemical process on a surface of a workpiece, comprising:
- a platen assembly comprising:
- a support platen;
- an electrolyte distribution plate atop said support platen;
- and
- a first conductive layer beneath said distribution plate and configured to be coupled to at least a first potential, said platen assembly being generally rectangular having a width defined by first and second opposite sides, said workpiece having a dimension greater than said width so that a peripheral region of said workpiece overhangs said platen assembly;
- and
- a carrier configured to carry the workpiece and position it proximate said electrolyte distribution plate;
- a reservoir for delivering an electrolyte to said electrolyte distribution plate;
- and
- a first contact rail along at least said first side of said platen assembly for engaging said peripheral region of said workpiece for coupling said workpiece to a second potential.
An apparatus for performing an electrochemical process on a surface of a workpiece, comprising:
- a platen assembly comprising:
- a support platen;
- an electrolyte distribution plate;
- and
- a first conductive layer configured to be coupled to at least a first potential;
- a carrier configured to carry the workpiece and position the workpiece proximate the electrolyte distribution plate;
- a rigid structure for supporting the platen assembly and carrier;
- a conduit for delivering an electrolyte to said electrolyte distribution plate;
- and
- at least one contact mounted to the structure for engaging a peripheral region of said workpiece for coupling said workpiece to a second potential.
An apparatus for performing an electrochemical process on a major surface of a semiconductor wafer, comprising:
- a platen assembly comprising a support platen and an electrolyte distribution plate;
- a first conductive layer proximate said electrolyte distribution plate, configured to be coupled to at least a first potential;
- a motion generator connected to said platen assembly configured to produce a non-rotational platen motion in a plane parallel to the surface of the wafer;
- a carrier configured to hold the wafer, and to rotate the wafer about an axis perpendicular to the surface of the wafer;
- a supply of electrolyte solution;
- and
- at least one contact supported independently from the platen assembly and carrier, and positioned to physically engage a peripheral region of said wafer major surface, thereby coupling the wafer surface to a second potential.
Dependencies are inferred from the claim text.