Pad assembly for electrochemical mechanical processing
AssigneeApplied Materials, Inc.
InventorsShou-Sung Chang, Stan D. Tsai, Donald J.K. Olgado, Liang-Yuh Chen, Alain Duboust, Ralph M. Wadensweiler
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Abstract
Embodiments of a pad assembly for processing a substrate are provided. The pad assembly includes a processing layer having a working surface adapted to process a substrate, a lower layer coupled to and disposed below the processing layer, and an electrode having an upper surface disposed above the lower layer and below the working surface of the processing layer. The upper surface of the electrode is at least partially exposed to the working surface to provide an electrolyte pathway between the upper surface of the electrode and the working surface.
Claims36
A pad assembly for processing a substrate, comprising:
- a processing layer having a working surface adapted to process a substrate;
- a lower layer coupled to and disposed below the processing layer;
- and
- an electrode having an upper surface disposed above the lower layer and below the working surface of the processing layer, wherein the upper surface of the electrode is at least partially exposed to the processing surface to provide an electrolyte pathway between the upper surface of the electrode and the working surface.
A pad assembly for processing a substrate, comprising:
- an upper layer having a working surface and a lower surface;
- an electrode coupled to the lower surface of the upper layer;
- at least one groove in the working surface of the upper layer;
- and
- a plurality of holes formed through the upper layer within the at least one groove and extending to the lower surface.
A system for electromechanical processing a substrate, comprising:
- a platen;
- a carrier head adapted to retain the substrate during processing;
- a lower layer disposed on the platen;
- a processing layer disposed on the lower layer and having a working surface adapted to process a substrate;
- and
- an electrode having an upper surface disposed above the lower layer and below the working surface of the processing layer, wherein the upper surface of the electrode is at least partially exposed to the processing surface to provide an electrolyte pathway between the upper surface of the electrode and the working surface.
Dependencies are inferred from the claim text.