Printed wiring board and printed wiring board manufacturing method
AssigneeSeiko Epson Corporation
InventorsEiji Takagi, Yuichi Kojima
Life of this patent
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Abstract
To manufacture a printed wiring board, the positions and shapes of several slits to satisfy UL796 standard, etc., formed in a ground or power supply plane are determined so that each slit is formed in a section corresponding to a ground guard in a portion containing a signal line and a signal line gap.
Claims7
A printed wiring board comprising:
- a portion containing a signal line and a signal line gap;
- and
- at least one of a ground and a power supply plane formed with at least one slit,
- wherein a shape and a position of the slit formed in the ground or power supply plane are determined so that the slit does not exist in a section opposed to the portion containing the signal line and the signal line gap.
A printed wiring board according to claim, wherein the slit is a slit formed to satisfy a condition concerning a maximum conductor area in UL796 standard.
A method for manufacturing a printed wiring board comprising a portion containing a signal line and a signal line gap, and at least one of a ground and a power supply plane, said method comprising:
- a shape and position determination step of determining the number of slits to be formed in the ground or power supply plane and the shape and the position of each slit so that the portion containing the signal line and the signal line gap does not exist in a section opposed to each slit and a predetermined condition is satisfied;
- and
- a printed wiring board manufacturing step of manufacturing a printed wiring board with the number of slits formed in the ground or power supply plane and the shape and the position of each slit matching a processing result in said shape and position determination step.
Dependencies are inferred from the claim text.