Printed circuit board employing lossy power distribution network to reduce power plane resonances
AssigneeSun Microsystems, Inc.
InventorIstvan Novak
Life of this patent
Estimating the term…
Abstract
An interconnecting apparatus employing a lossy power distribution network to reduce power plane resonances. In one embodiment, a printed circuit board includes a lossy power distribution network formed by a pair of parallel planar conductors separated by a dielectric layer.
Claims22
A printed circuit board comprising:
- a first conductive layer forming a first power supply plane;
- a second conductive layer forming a second power supply plane;
- a first dielectric layer separating the first and second conductive layers;
- a third conductive layer;
- and
- a second dielectric layer separating said second and third conductive layers,
- wherein said first dielectric layer has a thickness of no more than 0.5 mils.
A printed circuit board comprising:
- a first conductive layer forming a first power supply plane;
- a second conductive layer forming a second power supply plane;
- a first dielectric layer adjacent to and separating the first and second conductive layers;
- a second dielectric layer adjunct to said second conductive layer;
- a third conductive layer forming a third power supply plane, wherein the third conductive layer is adjacent to said second dielectric layer;
- a fourth conductive layer forming a fourth power supply plane;
- a third dielectric layer adjacent to and separating the third and fourth conductive layers.
The printed circuit board as recited in claim 14 further comprising a second via which electrically interconnects the second conductive layer and the fourth conductive layer.
A printed circuit board comprising:
- a first conductive layer forming a first power supply plane;
- a second conductive layer forming a second power supply plane;
- and
- a dielectric layer separating said first and second conductive layers, wherein said dielectric layer has a loss tangent value of at least 0.2.
An electrical interconnecting apparatus comprising:
- a first conductive layer forming a first power supply plane;
- a second conductive layer forming a second power supply plane;
- a first dielectric layer separating the first and second conductive layers;
- a third conductive layer;
- and
- a second dielectric layer separating said second and third conductive layers,
- wherein said first dielectric layer has a thickness of no more than 0.5 mils.
An electrical interconnecting apparatus comprising:
- a first conductive layer forming a first power supply plane;
- a second conductive layer forming a second power supply plane;
- a first dielectric layer adjacent to and separating the first and second conductive layers;
- a second dielectric layer adjunct to said second conductive layer;
- a third conductive layer forming a third power supply plane, wherein the third conductive layer is adjacent to said second dielectric layer;
- a fourth conductive layer forming a fourth power supply plane;
- a third dielectric layer adjacent to and separating the third and fourth conductive layers.
Dependencies are inferred from the claim text.