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US 2004/0163843 A1Published application
Multi-chip package with soft element and method of manufacturing the same
OwnerDong-Kil Shin, Dong-Ho Lee +2inventors
InventorsDong-Kil Shin, Dong-Ho Lee, Ho-Jeong Moon, Sang-Young Kim
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Abstract
According to embodiments of the invention, a multi-chip package includes a soft element which is more elastic and flexible than the encapsulant on the sides or upper surface of the chips. Therefore, stress concentration and chip crack is prevented by ensuring vertical mobility of the chips.
Claims20
A multi-chip package comprising:
- at least two semiconductor chips vertically mounted on a substrate and encapsulated with a mold resin;
- and
- a soft element located at an interface between at least one of the at least two semiconductor chips and the mold resin, the soft element being more elastic and flexible than the mold resin.
A device comprising:
- at least two semiconductor chips stacked on a substrate;
- a soft element formed on a surface of at least one of the at least two semiconductor chips;
- and
- an encapsulant covering the at least two semiconductor chips and the soft element, the soft element configured to reduce the constrictive force of the encapsulant on the surface.
1 more element
A method of manufacturing a multi-chip package, comprising:
- vertically stacking at least two semiconductor chips on a substrate;
- bonding a bond pad on at least one of the at least two semiconductor chips to a bond finger on the substrate with a bonding wire;
- forming a soft element on at least one side of at least one of the at least two semiconductor chips;
- and
- encapsulating the at least two semiconductor chips and the soft element using a mold resin.
2 more elements
Dependencies are inferred from the claim text.