Connecting method for structure with implantable electrodes
AssigneeMicrovitae Technologies
InventorThierry Herve
Life of this patent
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Abstract
The invention concerns a method for connecting first contact studs (16) of a structure (1) bearing electrodes (4) for measuring or for stimulating a physiological activity with second studs (17) of at least a downstream circuit (2), each second stud (17) being traversed by an opening (15) perforating the downstream circuit. The method comprises the following steps: a) placing the downstream circuit on said structure, so that the opening (15) of a second stud (17) is located opposite a first stud (16); and b) depositing in the opening (15) of the second stud (17) a conductive material (18) providing the connection between the first and the second stud opposite.
Claims10
A method for connecting first pads (16) of a structure (1, 1′, 1″) supporting electrodes (4) capable of measuring or of stimulating an activity of physiological origin to second pads (17) of at least one downstream circuit (2, 2a, 2b, 40, 50), each second pad (17) being run through by an opening (15) perforating the downstream circuit, comprising the steps of:
- a) placing the downstream circuit on said structure, so that the surface of the downstream circuit devoid of the second pads is in contact with the structure and that the opening (15) of a second pad (17) is placed opposite to a first pad (16);
- and
- b) depositing in the opening (15) of the second pad (17) a conductive material (18) ensuring the connection between the second pad and the first opposite pad.
Dependencies are inferred from the claim text.