Compact thermosiphon for dissipating heat generated by electronic components

Abstract

A compact thermosiphon assembly for dissipating heat generated by electronic components using a working fluid includes a tube having a first end and a second end and a flat cross section defining an elongated chamber is disclosed. The tube has an evaporation region for receiving heat to evaporate the working fluid into a vaporized working fluid within the chamber disposed between a first condensation region and a second condensation region opposite the first condensation region for condensing the vaporized working fluid back into a liquefied working fluid within the chamber. Each of the condensation regions have a first portion extending upwardly at a first angle from the evaporation region and a second portion extending upwardly at a second angle different than the first angle.

Dependencies are inferred from the claim text.