Cooling system for densely packed electronic components
AssigneeEmerson Network Power, Energy Systems, North America, Inc.
InventorsMichael R. Cosley, Richard L. Fischer
Life of this patent
Estimating the term…
Abstract
A more efficient cooling system for densely packed electronic components for use in an out-of-doors equipment enclosure. An array of cooling assemblies are placed on heat generating components mounted to printed circuit boards mounted in enclosure racks. Each board has a manifold for intake and exhaust of refrigerant, and larger rack manifolds are substituted for rails and are attached to a backplane. A hybrid package including a ceramic hybrid power module and an attached array of cooling assemblies provide even more density of components and improved cooling.
Claims14
A cooling system for electronic equipment enclosures with densely packed components comprising:
- an electronic equipment enclosure;
- a rack mounted within said enclosure;
- a plurality of boards mounted to said rack, at least one of said boards having a plurality of heat generating components mounted thereon;
- a plurality of microscale cooling assemblies each one of said cooling assemblies being connected to one of said plurality of heat generating components, each cooling assembly including a heat insulative housing, an inlet port formed in said housing for receiving a heat transferring fluid, an outlet port formed in said housing for passing said heat transferring fluid, a thermally conductive element connected to said housing, an evaporator chamber formed by said housing and said thermally conductive element upstream of said outlet port and a capillary passage formed in said housing between said inlet port and said evaporator chamber;
- a first intake manifold mounted to said rack;
- a first exhaust manifold mounted to said rack;
- a second intake manifold mounted to said board and to said first intake manifold;
- a second exhaust manifold mounted to said board and to said first exhaust manifold;
- a first fluid conduit connecting said board mounted second intake manifold and each of said plurality of cooling assemblies;
- a second fluid conduit connecting said board mounted first exhaust manifold and each of said plurality of cooling assemblies;
- a compressor;
- a third fluid conduit connecting said rack mounted first intake manifold and said compressor;
- and
- a fourth fluid conduit connecting said rack mounted first exhaust manifold and said compressor.
A cooling system for densely packed heat generating components comprising:
- a board having a plurality of heat generating components mounted thereon;
- a plurality of microscale cooling assemblies each one of said cooling assemblies being connected to one of said plurality of heat generating components, each cooling assembly including a heat insulative housing, an inlet port formed in said housing for receiving a heat transferring fluid, an outlet port formed in said housing for passing said heat transferring fluid, a thermally conductive element connected to said housing, an evaporator chamber formed by said housing and said thermally conductive element upstream of said outlet port and a capillary passage formed in said housing between said inlet port and said evaporator chamber;
- an intake manifold mounted to said board;
- an exhaust manifold mounted to said board;
- a fluid conduit connecting said intake manifold and each of said plurality of cooling assemblies;
- and
- a fluid conduit connecting said exhaust manifold and each of said plurality of cooling assemblies.
A hybrid electronic package for an electronic equipment enclosure comprising:
- a layer of d-c electronics and controls;
- a cover connected to said layer;
- a ceramic hybrid power module including components connected to said cover;
- an array of cooling assemblies connected to said module;
- a compressor;
- a condenser;
- and
- two conduits connecting said compressor and said condenser and said array of cooling assemblies.
Dependencies are inferred from the claim text.