Method of cleaning a substrate
AssigneeSamsung Electronics Co., Ltd.
InventorsDae-Hyuk Chung, Kwang-Wook Lee, In-Joon Yeo
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Abstract
To clean contaminants on a substrate including a metal wiring formed thereon, a cleaning solution including diluted aqueous sulfuric acid solution is applied onto the substrate. Mega-sonic energy is applied to the cleaning solution on the substrate. The contaminants are removed from the substrate in accordance with the reaction between the diluted aqueous sulfuric acid solution and the contaminant while the mega-sonic energy is applied to the substrate. The corrosion of the metal wiring is prevented because of the cleaning solution including the diluted aqueous sulfuric acid solution. Additionally, the damage of the substrate is reduced because the mega-sonic energy is appropriately applied to the substrate.
Claims14
A method of cleaning a substrate comprising:
- applying an aqueous sulfuric acid solution diluted by deionized water onto the substrate;
- and
- cleaning contaminants on the substrate in accordance with a reaction between the diluted aqueous sulfuric acid solution with the contaminants by applying a mega-sonic energy to the substrate including the diluted aqueous sulfuric acid solution.
A method of cleaning a substrate comprising:
- providing an aqueous sulfuric acid solution diluted by deionized water in a bath;
- immersing the substrate into the diluted aqueous sulfuric acid solution;
- and
- cleaning contaminants on the substrate in accordance with a reaction between the diluted aqueous sulfuric acid solution and the contaminants by applying a mega-sonic energy to the substrate including the diluted aqueous sulfuric acid solution.
Dependencies are inferred from the claim text.