Method and assembly for providing impedance matching network and network assembly
AssigneeTokyo Electron Limited
InventorThomas H. Windhorn
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AssigneeTokyo Electron Limited
InventorThomas H. Windhorn
Estimating the term…
An impedance matching network and network assembly employ one or more variable inductive elements, wherein one or more of the variable inductive elements includes a high temperature ferrite core, a helical coil, and a means for physically translating the magnetic core through the helical coil. An impedance matching network may alternatively or additionally employ one or more variable inductive elements, wherein one or more of the variable inductive elements is cooled using a fan assembly. Further, the impedance matching network and network assembly may alternatively or additionally employ one or more variable inductive elements, wherein the cooling of one or more of the variable inductive elements is facilitated by increasing the surface area of the variable inductive element core.
A high power, radio frequency matching network for a plasma processing system, the matching network comprising:
A plasma processing system comprising:
A high power, radio frequency matching network assembly for a plasma processing system, the matching network assembly comprising:
Dependencies are inferred from the claim text.