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US 2004/0163475 A1Published application
Sensor having membrane and method for manufacturing the same
AssigneeDenso Corporation
InventorsToshiya Ikezawa, Takashige Saitou, Masaaki Tanaka
Life of this patent
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Abstract
A sensor device includes a circuit chip, an adhesion film, and a sensor chip mounted on the circuit chip through the adhesion film. The sensor chip includes a substrate having foreside and backside surfaces, a concavity disposed on the backside surface of the substrate, and a membrane disposed on the foreside surface of the substrate so that the membrane covers the concavity. The adhesion film is disposed between the sensor chip and the circuit chip so as to form a passage for connecting between the concavity and an outside of the concavity.
Claims16
A sensor device comprising:
- a circuit chip;
- an adhesion film;
- and
- a sensor chip mounted on the circuit chip through the adhesion film,
- wherein the sensor chip includes:
- a substrate having foreside and backside surfaces;
- a concavity disposed on the backside surface of the substrate;
- and
- a membrane disposed on the foreside surface of the substrate so that the membrane covers the concavity, and
- wherein the adhesion film is disposed between the sensor chip and the circuit chip so as to form a passage for connecting between the concavity and an outside of the concavity.
7 more elements
Dependencies are inferred from the claim text.