Apparatus and method for cooling electronic systems

A cooling system for an electronic device comprising:

• an electronic device chassis, said electronic device chassis comprising at least one roll-bond evaporator panel forming at least a portion of said electronic device chassis;
• a packaged refrigeration module, said packaged refrigeration module comprising:
• a packaged refrigeration module housing;
• refrigerant;
• a compressor;
• a condenser;
• and
• an expansion device;
• wherein,
• said compressor, said condenser, and said expansion device of said packaged refrigeration module and said at least one roll-bond evaporator panel forming at least a portion of said electronic device chassis are coupled together in a refrigeration loop within said electronic device chassis.

A blade-cooling system, said blade-cooling system comprising:

• a blade-cooling system housing;
• refrigerant;
• a compressor;
• a condenser;
• an expansion device;
• and
• an evaporator;
• wherein,
• said compressor, said condenser, and said expansion device and said evaporator of said blade-cooling system are coupled together in a refrigeration loop within said blade-cooling system housing;
• further wherein;
• said blade-cooling system housing is sized such that said blade-cooling system fits within a blade server station in a blade server frame.