Metal core substrate printed wiring board enabling thermally enhanced ball grid array ( BGA) packages and method
AssigneeUnicap Electronics Industrial Corporation
InventorsJane Lu, Paul Wu, Ray Chen, Scott Chen, Jeff Chang
Life of this patent
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Abstract
A thermally enhanced face-up BGA substrate consists of a metal (copper) core, layers, dielectric layers, conductive through-core and build-up vias. It is a new and simple structure with better thermal performance, resulting in lower cost and better reliability. Moreover, high degree of flexibility in choice of material and layer counts as well as layer thickness allows for a wide range of applications in packaging and high density printed circuit board.
Claims16
A method of making a thermally enhanced printed circuit wiring board substrate for ball grid integrated circuit packages comprising the steps of:
- a) providing an initial thin conductive metal core having oppositely facing surfaces,
- b) forming one or more holes in said metal core at each of a plurality of through-core via sites,
- c) laminating a thin rigidifying non-conductive dielectric sheet to each said oppositely facing surfaces, respectively, and
- d) applying at least one thin conductive layer on a surface of one of said thin rigidifying non-conductive sheets and making at least one electrical connection to said initial thin conductive metal core at one of said plurality of through-core via sites.
A thermally enhanced printed circuit (PC) wiring board for ball grid integrated circuit packages comprising a relatively thin, conductive metal core layer having oppositely facing surfaces and one or more holes in the metal core at each of a plurality of through-core via sites,
- a first and second thin rigidifying non-conductive laminate sheet attached to said oppositely facing surfaces, respectively, and
- at least one conductive circuit pattern on at least one of said thin rigidifying non-conductive sheets and a plurality of vias thereon.
Dependencies are inferred from the claim text.