Circuit forming board and method of manufacturing circuit forming board
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorToshihiro Nishii
Life of this patent
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Abstract
In order to improve the adhesion of a circuit to a circuit forming board, a separation film (4) comprising a base film and a coating layer formed on the base film is joined to both the sides of the board (1). When a laser beam (5) is applied to form a throughhole (6) in the board (1), a unified portion (7) of the board (1) and the separation film (4) is formed around the throughhole (6). An energy beam is applied to the whole or a part of the surface of a circuit formed at a circuit forming step to transfer a part of the separation file. Thus, a high density board where the circuit strongly adheres to the board can be realized in the manufacturing process of the circuit forming board.
Claims25
A manufacturing method of circuitry forming substrates comprising the steps of:
- forming through holes or non-through holes on a plate-like or sheet-like substrate formed of a single material or a plurality of materials by irradiating an energy beam thereon;
- forming a connecting means in said through hole or non-through hole formed in said hole forming step to connect electrically between the upper surface and the lower surface of said substrate or between the outer layer and the inner layer of said substrate;
- and
- forming a circuit on the surface of said substrate by disposing a conductive layer formed of a metal foil or a thin film on said surface and patterning said conductive layer to a desired configuration,
- wherein said each respective step is performed independently or the elements of said respective step are intermingled with one another for the purpose of achieving what is intended for by said respective steps, and further comprising the steps of:
- attaching by adhesion a film-like separation film on a surface or both surfaces of said substrate before said step of forming holes;
- and
- having part of said separation film transferred onto said substrate.
A manufacturing method of a circuitry forming substrate comprising the steps of:
- forming through holes or non-through holes on a plate-like or sheet-like substrate formed of a single material or a plurality of materials by irradiating an energy beam thereon;
- forming a connecting means in said through hole or non-through hole formed in said hole forming step to connect electrically between the upper surface and the lower surface of said substrate or between the outer layer and the inner layer of said substrate;
- and
- forming a circuit on the surface of said substrate by disposing a conductive layer formed of a metal foil or a thin film on said surface and patterning said conductive layer to a desired configuration,
- wherein said each respective step is performed independently or the elements of said respective step are intermingled with one another for the purpose of achieving what is intended for by said respective steps, and further comprising the steps of:
- attaching by adhesion a film-like separation film on a surface or both surfaces of said substrate before said step of forming holes;
- and
- making said substrate and separation film into a one-piece structure more intensely in the periphery of said through holes or said non-through holes in said step of forming holes.
A manufacturing method of a circuitry forming substrate comprising the steps of:
- forming through holes or non-through holes on a plate-like or sheet-like substrate formed of a single material or a plurality of materials by irradiating an energy beam thereon;
- forming a connecting means in said through hole or non-through hole formed in said hole forming step to connect electrically between the upper surface and the lower surface of said substrate or between the outer layer and the inner layer of said substrate;
- and
- forming a circuit on the surface of said substrate by disposing a conductive layer formed of a metal foil or a thin film on said surface and patterning said conductive layer to a desired configuration,
- wherein said each respective step is performed independently or the elements of said respective step are intermingled with one another for the purpose of achieving what is intended for by said respective steps, and further comprising the steps of:
- attaching by adhesion a film-like separation film on both surfaces of said substrate before said step of forming holes;
- and
- having said separation film near a perimeter or in a periphery of said through hole or said non-through hole made to an elevated area, which is formed of said separation film or mainly of said separation film with said substrate included and located at both sides or one side of an outside and a substrate side of said separation film in the hole forming step, so as to make a thickness of said elevated area larger at an energy beam incident side than at an energy beam releasing side.
A circuitry forming substrate structured in such a way as a substrate material beneath a circuit or a land formed on a surface of a substrate shows a stepwise reduction in a thermoplastic property as a distance from beneath said circuit or land increases in a thickness direction of said substrate.
A circuitry forming substrate provided with a one-piece structured area formed of a substrate material and a separation film, said one-piece structured area extending over an entire surface beneath a circuit formed on an upper surface of said circuitry forming substrate.
A circuitry forming substrate provided with a one-piece structure area formed of a substrate material and a separation film on a peripheral surface of a through hole or a non-through hole formed on said circuitry forming substrate.
Dependencies are inferred from the claim text.