Low dielectric loss signal line
AssigneeHewlett-Packard Development Company, L.P.
InventorsJames J. deBlanc, David Dickey, Andrew Michael Cherniski
Life of this patent
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Abstract
A circuit board or microelectronic device in which conductive signal lines are suspended or supported by filaments in air, rather than surrounded by a solid dielectric material. Dry air has a low relative permittivity and extremely low loss tangent compared with common dielectric substrates in which signal lines are currently embedded within circuit boards and microelectronic devices. The signal intensity attenuation for filament-suspended or filament-supported signal lines is much lower than signal lines embedded in solid dielectric materials, allowing for transmission of significantly higher frequency signals within filament-suspended and filament-supported signal lines.
Claims20
A low dielectric loss signal line comprising:
- a conductive trace;
- and
- filaments holding the conductive trace, surrounded by air, in a fixed relationship to one or more surfaces within an electronic device.
A method for fabricating a filament-affixed trace within an electronic device, the method comprising:
- providing a composite substrate containing filaments in a matrix bonded to an underlying solid material;
- affixing a conductive trace to an exposed surface of the composite substrate;
- and
- removing the matrix to leave the trace affixed by filaments to the underlying solid material.
Dependencies are inferred from the claim text.