US 2004/0163243 A1 · Electronic component placement machine and electronic component placement method

Abstract

An electronic component placement machine and an electronic component placement method are disclosed. A takeout and transfer head, provided on rotary chip takeout and transfer mechanism, removes a chip from a feeder and flips it. A placement head receives the flipped chip and places it onto a board. An image of the chip at a pre-centering recognition position is captured during a takeout and transfer operation, during which the takeout and transfer head transfers the chip to the placement head at a receiving position, so as to recognize the position. Based on this positional recognition result, the chip and the placement head are positioned by controlling a placement head driving mechanism. Moreover, the takeout and transfer head is rotated to a position which does not hinder image capturing of the electronic component for placement positioning.

Drawings

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Drawings

Claims16

Dependent claims

An electronic component placement machine comprising:

a takeout and transfer head;
a feeder for supplying an electronic component to said takeout and transfer head at a feeding position;
a board holder for holding a board onto which the electronic component is to be placed;
a feeder camera unit for capturing an image of the electronic component while in said feeder;
a takeout positioning device for positioning the electronic component relative to said takeout and transfer head based on a positional recognition result of the electronic component obtained by recognizing the image captured by said feeder camera unit;
a takeout and transfer device for causing said takeout and transfer head to remove the electronic component from said feeder at the feeding position, and for flipping the electronic component while transferring the electronic component to a receiving position;
a placement head for receiving the electronic component from said takeout and transfer head at the receiving position, and for placing the electronic component onto the board;
a placement head camera unit for capturing an image of the electronic component, while held by said placement head at the receiving position, from beneath said placement head;
and
a placement positioning device for positioning the electronic component, while held by said placement head, relative to the board, while held by said board holder, based on a positional recognition result of the electronic component obtained by recognizing the image captured by said placement head camera unit.

7 more elements

An electronic component placement method comprising:

recognizing a position of an electronic component by capturing, via a feeder camera unit, an image of said electronic component while in a feeder;
positioning said electronic component relative to a takeout and transfer head based on a positional recognition result of said electronic component obtained by recognizing said position of said electronic component while in said feeder;
using said takeout and transfer head to remove said electronic component from said feeder at a feeding position, and transferring said electronic component to a receiving position;
using a placement head to receive said electronic component from said takeout and transfer head at said receiving position;
recognizing a position of said electronic component by capturing, via a placement head camera unit, an image of said electronic component from beneath said placement head while said electronic component is held by said placement head
positioning said electronic component, while held by said placement head, relative to a board, while held by a board holder based on a positional recognition result of said electronic component obtained by recognizing said position of said electronic component while held by said placement head;
placing said electronic component onto said board;
and
prior to capturing said image of said electronic component via said placement head camera unit, moving said takeout and transfer head from said receiving position to a position where capturing of said image by said placement head camera unit is not hindered.

6 more elements

An electronic component placement machine comprising:

a takeout and transfer head;
a placement head;
a feeder for supplying an electronic component to said takeout and transfer head at a feeding position;
a board holder for holding a board onto which the electronic component is to be placed;
a feeder camera unit for capturing an image of the electronic component while in said feeder;
a first positioning device for positioning the electronic component relative to said takeout and transfer head based on a positional recognition result of the electronic component obtained by recognizing the image captured by said feeder camera unit;
a takeout and transfer device for causing said takeout and transfer head to remove the electronic component from the feeding position, and for causing said takeout and transfer head to flip the electronic component while transferring the electronic component to a receiving position
a second positioning device for positioning the electronic component, after having been removed from the feeding position, relative to said placement head, wherein said placement head is for receiving this relatively positioned electronic component from said takeout and transfer head at the receiving position and placing the electronic component onto the board;
a placement head camera unit for capturing an image of the electronic component, while held by said placement head, from beneath said placement head;
and
a third positioning device for positioning the electronic component, while held by said placement head, relative to the board, while held by said board holder, based on a positional recognition result of the electronic component obtained by recognizing the image captured by said placement head camera unit.

8 more elements

An electronic component placement method comprising:

recognizing a position of an electronic component by capturing, via a feeder camera unit, an image of said electronic component while in a feeder;
positioning said electronic component relative to a takeout and transfer head based on a positional recognition result of said electronic component obtained by recognizing said position of said electronic component while in said feeder;
using a takeout and transfer head to remove said electronic component from said feeder at a feeding position, and to flip said electronic component while transferring said electronic component to a receiving position;
positioning said electronic component, after having been removed from said feeder, relative to a placement head;
using said placement head to receive said electronic component, after having been positioned relative to said placement head, from said takeout and transfer head at said receiving position;
recognizing a position of said electronic component by capturing, via a placement head camera unit, an image of said electronic component from beneath said placement head while said electronic component is held by said placement head,;
positioning said electronic component, while held by said placement head, relative to a board, while held by a board holder, based on a positional recognition result of said electronic component obtained by recognizing said position of said electronic component while held by said placement head;
and
placing said electronic component onto said board after said electronic component has been positioned relative to said board.

6 more elements

An electronic component placement machine comprising:

a takeout and transfer head;
a placement head;
a feeder for supplying an electronic component to said takeout and transfer head at a feeding position set to a height of a component feeding level;
a takeout and elevating device for vertically moving said takeout and transfer head at the feeding position;
a board holder for holding a board, onto which the electronic component is to be placed, at a board holding level, with the board holding level being higher than the component feeding level;
a feeder camera unit for capturing an image of the electronic component while in said feeder;
a takeout positioning device for positioning the electronic component relative to said takeout and transfer head based on a positional recognition result of the electronic component obtained by recognizing the image captured by said feeder camera unit;
a transfer and flipping device for causing said takeout and transfer head to remove the electronic component from said feeder at the feeding position, and for flipping the electronic component while transferring the electronic component to a transfer position which is set to a component transfer level, with the component transfer level being higher than the component feeding level;
a transfer and elevating device for vertically moving said takeout and transfer head at the transfer position;
and
a placement head transfer mechanism for moving said placement head relative to said board holder, wherein said placement head is to receive said electronic component, after having been flipped, from said takeout and transfer head at the transfer position.

8 more elements

Dependencies are inferred from the claim text.

Description8,010 words

Summary1,143 words

#The present invention relates to machines and methods for placing electronic components, such as flip chips, onto boards.

#A demand for higher positional accuracy in placing electronic components onto boards is increasing, and in response, methods are commonly adopted that use image recognition for correcting a positional deviation of an electronic component and board when placing the electronic component onto the board. Examples of this type of electronic component placement machine are disclosed in Japanese Laid-open Applications Nos. H2-56945 and H2-56944.

#The machine disclosed in No. H2-56945 is equipped with a flipping device for removing an electronic component from a feeder, and flipping and transferring the electronic component to a predetermined transfer position; and a placement head for receiving and holding this flipped electronic component and then transferring and placing it onto a board.

Brief description of the drawings12 figures

#FIG. 1 is a perspective view of an electronic component placement machine in accordance with a preferred embodiment of the present invention.

#FIG. 2 is a front view of the electronic component placement machine in accordance with the preferred embodiment of the present invention.

#FIG. 3 is a side view of the electronic component placement machine in accordance with the preferred embodiment of the present invention.

Detailed description6,563 words

#A preferred embodiment of the present invention is described below with reference to drawings.

#Drawings are schematic and thus do not show accurate dimensional positions. The present invention refers to a chip as an example of an electronic component. First, a configuration of an electronic component placement machine is described with reference to FIGS. 1 and 2. In FIG. 1, feeder 2 is disposed on a top face of base 1. Feeder 2 is configured by disposing chip holder 4 on a top face of chip holder transfer table 3 which has a structure featuring combined direct-acting tables. Chip holder 4 has wafer sheet 5 on which numerous chips 6 are attached. This wafer sheet 5 is held at a height of a component feeding level. Chips 6 are chips with bumps for external connection. A face of each chip 6 having the bumps thereon is facing upwardly, and a bottom face of each chip is attached to wafer sheet 5. Chip holder 4 horizontally moves together with chips 6 attached to wafer sheet 5 when chip holder transfer table 3 is driven.

#Stand 7 is disposed adjacent to feeder 2 on base 1. Board holder transfer table 8 is disposed on top plate 7a of stand 7. Board holder transfer table 8 has a structure featuring combined direct-acting tables. Board holder 9 is disposed on a top face of board holder transfer table 8 for holding board 10, onto which chips 6 are to be placed, at a height of a board holding level. This board holding level is set to be higher than the aforementioned component feeding level. Board holder 9 moves horizontally together with board 10 it is holding by driving board holder transfer table 8.

Facts

Application

10/781,787Filed 20 Feb 2004

Priority

JP 2003-04731325 Feb 2003

Published

26 Aug 2004

Term ends

Not estimatedThe source records don’t support an estimate.

Classification12 codes

H05K 13/081
Monitoring manufacture of assemblages: integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices…
H05K 13/046
Mounting of components , e.g. of leadless components: surface mounting
H05K 13/0815
Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling…
Y10T 29/4913
On flat or curved insulated base, e.g., printed circuit, etc.: assembling to base an electrical component, e.g., capacitor, etc.

Electronic component placement machine and electronic component placement method

Life of this patent

Electronic component placement machine and electronic component placement method

Life of this patent

Life of this patent

Abstract

Drawings

Drawings

Claims16

Description8,010 words

Drawings

Classification12 codes

Life of this patent

Description8,010 words