Manufacturing process of a stacked semiconductor device and corresponding device
AssigneeSTMicroelectronics S.r.l.
InventorGiovanni Frezza
Life of this patent
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Abstract
A manufacturing process of a stacked semiconductor device is described, comprising the following steps: integrating a plurality of electronic devices in a plurality of active areas realized in a semiconductor wafer (9a); distributing an adhesive layer on active areas, splitting the semiconductor wafer into a plurality of first dies, each one comprising at least one of the active areas; mounting the plurality of first dies, which are already equipped with the adhesive layer, on a support; and mounting a plurality of second dies on the adhesive layer. A stacked semiconductor device is also described, which comprises a first die mounted on a support, an intermediate adhesive layer and a second die mounted on the adhesive layer which is a polymeric layer.
Claims17
A manufacturing process of a stacked semiconductor device comprising the following steps:
- integrating a plurality of electronic devices in a plurality of active areas realized in a first semiconductor wafer;
- distributing a first adhesive layer on said active areas;
- splitting said semiconductor wafer into a plurality of first dies, each said first die comprising at least one of said active areas;
- mounting said plurality of first dies, which are already equipped with said adhesive layer on a support, and
- mounting a plurality of second dies on said adhesive layer.
A stacked semiconductor device comprising a first die mounted on a support, an intermediate adhesive layer and a second die mounted on said adhesive layer, wherein this adhesive layer is a polymeric layer.
A manufacturing process comprising:
- integrating a plurality of electronic devices in a plurality of active areas realized in a first semiconductor wafer;
- distributing a first adhesive layer on said active areas;
- mounting a second semiconductor wafer on said first adhesive layer, said second semiconductor wafer comprising a second plurality of dummy dies, said dummy dies being mounted on said active areas of said first semiconductor wafer;
- splitting said first semiconductor wafer into a plurality of first dies comprising said dummy dies;
- mounting said plurality of first dies on a substrate;
- distributing a second adhesive layer on said dummy dies;
- and
- mounting a third plurality of a third dies on said second adhesive layer.
Dependencies are inferred from the claim text.