Wire sawing device
AssigneeHCT Shaping Systems SA
InventorsAndreas Muller, Alexander Bortnikov
Life of this patent
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Abstract
The sawing device comprises a holding device (22) arranged so as to hold in the course of wire sawing the different sawed slices (23) substantially parallel and such that the width of the sawing gaps (24) is held constant. It comprises for this purpose holding members (25), for example in the form of a bar (30) whose resilient coating (31) is applied by springs (35) against a lower portion (26) of the slices (23). There are thus obtained slices without undulations, striations, breakages and irregularities; moreover, the invention permits easy repair of the layer of wires after breakage of the wire.
Claims17
Wire sawing device comprising at least one layer of wires stretched between at least two wire guide cylinders and held in position by grooves provided on the surface of said wire guide cylinders which define the interval between the wires of said layer of wires, and hence the thickness of the sawed slices separated from each other by sawing gaps, the wires being adapted to move with alternating or continuous movement whilst bearing against at least one piece to be sawed fixed on a support table, means being provided to carry out relative movement between the piece to be sawed and the layer of wires, wherein the sawing device comprises a holding device arranged to maintain, in the course of sawing, the partially or completely sawed slices substantially parallel to each other and such that the width of the sawing gaps is held substantially constant during sawing of the slices.
Dependencies are inferred from the claim text.