Memory devices and electronic systems comprising integrated bipolar and FET devices
AssigneeMicron Technology, Inc.
InventorArup Bhattacharyya
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AssigneeMicron Technology, Inc.
InventorArup Bhattacharyya
Estimating the term…
The invention includes BIFETRAM devices. Such devices comprise a bipolar transistor in combination with a field effect transistor (FET) in a three-dimensional stacked configuration. The memory devices can be incorporated within semiconductor-on-insulator (SOI) constructions. The base region of the bipolar device can be physically and electrically connected to one of the source/drain regions of the FET to act as a storage node for the memory cell. The semiconductor material of the SOI constructions can comprise Si/Ge, and the active region of the FET can extend into the Si/Ge. The SOI constructions can be formed over any of a number of substrates, including, for example, semiconductive materials, glass, aluminum oxide, silicon dioxide, metals and/or plastics.
A memory device comprising:
A memory cell construction, comprising:
A memory cell construction, comprising:
An electronic system, the electronic system comprising a memory device, the memory device including:
Dependencies are inferred from the claim text.