US 2004/0111244 A1 · Algorithm for fast determination of suspicious cites inside interconnect segments with the high probability of nucleation electromigration-induced voids

Abstract

The invention provides an algorithm for a methodology for interconnect design optimization by means of electromigration simulation. The algorithm provides for the capability to explore the effect of metal feature geometry, such as line width and height, a diffusion barrier (liner) material properties and thickness, via slop and corner rounding, and interconnect architecture (number of layers, feature density) on the probability of electromigration-induced and stressmigration-induced void nucleation. Implementation of all major driving forces for atom migration allows to predict a complete map of positions inside segments where void nucleation can be expected.

Claims8

Dependent claims

A method of predicting a probability distribution of void nucleation inside interconnnect segment, said method comprising the steps of:

a) providing geometry modeling for a set of trial parameters;
b) performing a thermal-electrical coupled simulation;
c) performing a thermal-mechanical coupled simulation;
d) determining a mass-balance equation N(r);
e) determining Nnuc from critical tensile stress based on said thermal-mechanical coupled simulation;
f) comparing N(r) to Nnuc;
g) if N(r) is less than Nnuc minimizing a number of void nucleation sites by modifying said set of trial parameters and returning to step (a);
and
h) if N(r) is greater than or equal to Nnuc, finishing said method.

6 more elements

Dependencies are inferred from the claim text.

Algorithm for fast determination of suspicious cites inside interconnect segments with the high probability of nucleation electromigration-induced voids

Life of this patent

Algorithm for fast determination of suspicious cites inside interconnect segments with the high probability of nucleation electromigration-induced voids

Life of this patent

Abstract

Claims8