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US 2004/0110453 A1Published application
Polishing pad conditioning method and apparatus
AssigneeIntel Corporation
InventorHerb Barnett III
Life of this patent
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Abstract
A method and apparatus is provided that comprises an improved substrate polishing pad conditioning plate. In one embodiment, the conditioning plate contains multiple channels interposed between the abrasive surfaces so as to manage slurry and debris to resist clogging the abrasive surface of the conditioning plate so as to enable conditioning of the polishing pad.
Claims20
A polishing pad conditioning apparatus, comprising:
- a substantially flat rotatable plate having a first conditioning side, a second side, a perimeter and a center, the conditioning side comprising a plurality of channels defining a plurality of conditioning surfaces, the conditioning surfaces being adapted to condition the surface of a polishing pad, the conditioning surfaces having a leading edge and a trailing edge, the channels adapted to move debris and slurry based on the rotation of the substantially flat rotatable plate.
A substrate polishing apparatus, comprising:
- a rotatable substrate containment head, the substrate containment head adapted to retain a substrate for polishing;
- a rotatable platen positioned to oppose the substrate containment head;
- a polishing pad coupled to the platen;
- and
- a polishing pad conditioning plate comprising a substantially flat rotatable plate having a first conditioning side, a second side, a perimeter and a center, the conditioning side comprising a plurality of channels defining a plurality of conditioning surfaces, the conditioning surfaces being adapted to condition the surface of a polishing pad, the conditioning surfaces having a leading edge and a trailing edge, the channels adapted to move debris and slurry based on the rotation of the substantially flat rotatable plate.
2 more elements
A method of conditioning a substrate polishing pad, comprising:
- providing a rotatable platen capable of rotating in a first direction and a second direction;
- providing a substrate polishing pad having a first side adapted to polish substrates and a second side adapted to engage the rotatable platen;
- providing a polishing pad conditioning plate comprising a substantially flat rotatable plate having a first conditioning side, a second side, a perimeter and a center, the conditioning side comprising a plurality of channels defining a plurality of conditioning surfaces, the conditioning surfaces being adapted to condition the surface of a polishing pad, the conditioning surfaces having a leading edge and a trailing edge, the channels adapted to move debris and slurry based on the rotation of the substantially flat rotatable plate, the second side adapted to couple with a polishing machine;
- placing the substrate polishing pad on the rotatable platen with the first side facing outward;
- rotating the platen and polishing pad;
- positioning the substantially flat rotatable plate such that the first side contacts the polishing surface of the polishing pad;
- and
- rotating the substantially flat rotatable plate.
5 more elements
Dependencies are inferred from the claim text.