Process for molding on a substrate

A process of molding a component on a substrate, comprising:

• providing first and second mating mold segments having surfaces that, when in a closed position, define a mold cavity for receiving a moldable material, the mold segments having complementary shaped faces that mate with each other at a parting line;
• providing a substrate having a contoured surface that conforms with the mold cavity defining surfaces of the first mold segment, the substrate having a peripheral flange conforming with the complementary shaped faces of the mold segments, the peripheral flange including at least one continuous circuitous ridge that projects from a surface of the flange;
• positioning the substrate in the first mold segment with the contoured surfaces of the substrate in registry with the mold cavity defining surfaces of the first mold segment, and with the peripheral flanges of the substrate overlapping and engaging the mating face of the first mold segment;
• closing the mold, whereby the flange is compressed between the mating faces of the mold segments, and wherein the mating face of the second mold segment engages and deforms the ridges of the flange to provide a peripheral seal along the parting line;
• introducing a moldable material into the mold cavity defined between the substrate and the second mold segment;
• allowing the moldable material to solidify and form a molded component conforming with the shape of the mold cavity defined between the substrate and the second mold segment;
• opening the mold;
• and
• removing an article including the substrate and the molded component secured to the substrate.