Anhydride polymers for use as curing agents in epoxy resin-based underfill material
AssigneeIntel Corporation
InventorsSaikumar Jayaraman, Rahul Manepalli
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Abstract
An underfill material is presented that may be used between an electrical component and a substrate. The underfill material may be a cured epoxy resin composition comprising a liquid or semisolid epoxy resin and a polyfunctional anhydride polymer and/or oligomer curing agent. The use of anhydride polymers and/or oligomers decrease the volatilization of the composition, thereby reducing the porosity of the underfill material. By changing substituents of the anhydride polymer and/or oligomer, the underfill material may be designed to modify viscosity, decrease moisture adsorption, volatilization and modulus, improve mechanical properties, and enhance adhesion.
Claims24
An underfill composition comprising:
- a resin;
- and
- a curing agent selected from the group consisting of anhydride polymers,
- anhydride oligomers, anhydride copolymers and mixtures thereof.
An underfill material that is a cured epoxy resin composition comprising:
- one of a liquid and semisolid epoxy resin;
- and
- a curing agent selected from the group consisting of anhydride polymers,
- anhydride oligomers, anhydride copolymers, and mixtures thereof.
A device comprising:
- a substrate;
- an electrical component;
- and
- an underfill composition between the electrical component and the substrate,
- the underfill composition including
- a resin;
- and
- a curing agent selected from the group consisting of anhydride
- polymers, anhydride oligomer, anhydride copolymers and mixtures thereof.
A method of fabricating a device, comprising:
- fabricating an integrated circuit chip, the integrated circuit chip including
- a plurality of electrical bond pads;
- fabricating a substrate,
- positioning the integrated circuit chip relative to the substrate;
- providing electrical connection between the integrated circuit chip and the substrate during a reflow operation;
- providing an underfill composition between the integrated circuit chip and the substrate, the underfill composition including
- a resin;
- and
- a curing agent selected from the group consisting of anhydride polymers, anhydride oligomers, anhydride copolymers, and a mixture thereof.
Dependencies are inferred from the claim text.