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US 2004/0106717 A1Published application
Heat conductive silicone composition and shaped article
AssigneeShin-Etsu Chemical Co., Ltd.
InventorMasaya Asaine
Life of this patent
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Abstract
A heat conductive silicone composition comprising (a) an organopolysiloxane having alkenyl groups only at both ends of a molecular chain, (b) a heat conductive filler, (c) an organohydrogenpolysiloxane having Si—H groups only at both ends of a molecular chain, and (d) a platinum group curing catalyst is shaped into an article which conforms to a member and permits heat to dissipate from the member without applying stresses thereto.
Claims4
A heat conductive silicone composition comprising
- (a) 100 parts by weight of an organopolysiloxane having alkenyl groups only at both ends of a molecular chain,
- (b) 200 to 3,000 parts by weight of a heat conductive filler,
- (c) an organohydrogenpolysiloxane having hydrogen atoms directly bonded to silicon atoms (Si—H groups) only at both ends of a molecular chain, in such an amount that 0.1 to moles of Si—H groups are available per mole of alkenyl groups in component (a), and
- (d) a platinum group base curing catalyst in an amount to give 0.1 to 500 ppm of platinum group element based on the weight of component (a).
1 more element
Dependencies are inferred from the claim text.