Substrate processing apparatus
AssigneesEbara Corporation, Kabushiki Kaisha Toshiba
InventorsYou Ishii, Masayuki Nakanishi, Kenro Nakamura
Life of this patent
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Abstract
A substrate processing apparatus according to the present invention has a polishing tape and a polishing head for pressing the polishing tape against a peripheral portion of a semiconductor wafer. The substrate processing apparatus polishes the wafer due to sliding contact of the polishing tape and the wafer. The polishing head has an elastic body for supporting the polishing tape. The substrate processing apparatus has an air cylinder for pressing the polishing head so that the elastic body of the polishing head presses the polishing tape against the predetermined portion of the wafer under a constant force.
Claims13
A substrate processing apparatus comprising:
- a polishing tape;
- a polishing head having an elastic body for supporting said polishing tape;
- and
- a pressing mechanism for pressing said polishing head so that said elastic body of said polishing head presses said polishing tape against a predetermined portion of a substrate under a constant force,
- wherein the substrate is polished by sliding contact between said polishing tape and the substrate.
A substrate processing apparatus comprising:
- a polishing tape;
- and
- a polishing head for pressing said polishing tape against a predetermined portion of a substrate, said polishing head comprising:
- a deformable fluid bag for supporting said polishing tape, a pressurized fluid being supplied to an interior of said fluid bag, and
- a support portion for receiving said fluid bag and supporting said fluid bag.
Dependencies are inferred from the claim text.