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AssigneeIntel Corporation
InventorsReza M. Golzarian, Mansour Moinpour, Andrea C. Oehler
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The present invention relates to the manufacture and use of novel pre-coated abrasive particles and particle slurries for the chemical mechanical polishing (CMP) of semiconductor wafers, thin films, inter-layer dielectric, metals, and other components during integrated circuit, flat panel display, or MEMS manufacturing. For example, polishing slurry abrasive particles can be pre-coated with additives, such as, inhibitors and/or surfactants during manufacture of the abrasive particles or slurry. The additive's opportunity to react directly with the abrasive particles early in the particle manufacturing process provides a slurry having a more stable, selectable, and predictable ratio of abrasive particles pre-coated with a more stable, selectable, and predictable amount and type of additives.
A method comprising:
A method comprising:
A composition comprising:
A system for producing pre-coated abrasive particles for chemical-mechanical polishing, said system comprising:
Dependencies are inferred from the claim text.