Film lamination apparatus and method and a manufacturing method of a semiconductor apparatus
AssigneeFujitsu Limited
InventorsKazuo Teshirogi, Yuzo Shimobeppu, Yoshiaki Shinjo
Life of this patent
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Abstract
In a film lamination apparatus and method, there is no one-side contact of a pressing roller that presses a film to be laminated. The film is laminated using a rotatable pressing roller having a heater incorporated therein. The pressing roller is pressed onto the film placed on a semiconductor substrate while generating heat by the heater inside the pressing roller. The pressing roller is rolled on the film so as to laminate the film on the semiconductor substrate by partially heating the film by the pressing roller while moving the pressing roller.
Claims17
A film lamination method for laminating a film on a principal surface of a semiconductor substrate by using a rotatable roller having a heat-generating part therein, the film lamination method comprising:
- pressing the roller onto the film placed on the principal surface of the semiconductor substrate while generating heat by the heat-generating part;
- and
- rolling the roller on the film so as to laminate the film on the semiconductor substrate by heat from the heat-generating part.
A film lamination method for laminating a film on a principal surface of a semiconductor substrate by using a table supporting the semiconductor substrate and a rotatable roller, the table having a plurality of heat-generating parts therein, the film lamination method comprising pressing the roller onto the film placed on the principal surface of the semiconductor substrate and rolling the roller on the film while selectively activating the heat-generating parts in response to a movement of the roller so as to laminate the film on the semiconductor substrate by heat from the heat-generating parts.
A film lamination method for laminating a film on a principal surface of a semiconductor substrate by using a rotatable roller and a table supporting the semiconductor substrate, a heat-generating part being movably provided under the table, the film lamination method comprising pressing the roller onto the film placed on the principal surface of the semiconductor substrate and rolling the roller on the film while moving the heat-generating part in response to a movement of the roller so as to laminate the film on the semiconductor substrate by heat from the heat-generating part.
A film lamination apparatus comprising:
- a table on which a semiconductor substrate to be processed is placed and fixed;
- and
- a roller pressing an attachment film onto the semiconductor substrate while rolling on the attachment film,
- wherein said roller includes:
- a cylindrical metal member;
- a heat-generating part provided in the cylindrical metal member;
- and
- a resin layer covering an outer surface of said cylindrical metal member.
A film lamination apparatus comprising:
- a table on which a semiconductor substrate to be processed is placed and fixed;
- and
- a roller pressing an attachment film onto the semiconductor substrate while rolling on the attachment film,
- wherein said roller includes:
- a cylindrical elastic member;
- and
- a heat-generating part provided in the cylindrical elastic member.
A film lamination apparatus comprising:
- a table on which a semiconductor substrate to be processed is placed and fixed;
- and
- a roller assembly having a plurality of short rollers each pressing an attachment film onto the semiconductor substrate while rolling on the attachment film,
- wherein said roller assembly includes a plurality of heat-generating rods parallel to a direction perpendicular to a laminating direction, the heat-generating rods provided with cylindrical metal members, respectively, so that parts of the cylindrical metal members overlap with each other in an axial direction of the heat-generating rods.
A film lamination apparatus comprising:
- a table on which a semiconductor substrate to be processed is placed and fixed;
- a roller pressing an attachment film onto the semiconductor substrate while rolling on the attachment film;
- and
- a heat-generating part provided in said table, wherein the heat-generating part is divided in to a plurality of small heat-generating parts arranged in a direction of movement of the roller.
A film lamination apparatus comprising:
- a table on which a semiconductor substrate to be processed is placed and fixed;
- a roller pressing an attachment film onto the semiconductor substrate while rolling on the attachment film;
- and
- a heat-generating part provided under said table, the heat-generating part being movable in response to a movement of said roller.
A manufacturing method of a semiconductor device, comprising the steps of:
- grinding another principal surface of the semiconductor substrate so as to thin the semiconductor substrate;
- applying an attachment film onto the another principal surface of the semiconductor substrate;
- and
- individualizing the semiconductor substrate into a plurality of semiconductor elements, wherein the attachment film is laminated on the semiconductor substrate by pressing the attachment film placed on the another principal surface of the semiconductor substrate by a rotatable roller having a heat-generating part therein and rolling the roller on the attachment film while generating heat by the heat-generating part.
A manufacturing method of a semiconductor device, comprising the steps of:
- grinding another principal surface of the semiconductor substrate so as to thin the semiconductor substrate;
- applying an attachment film onto the another principal surface of the semiconductor substrate;
- and
- individualizing the semiconductor substrate into a plurality of semiconductor elements,
- wherein the attachment film is laminated on the semiconductor substrate by pressing by a rotatable roller the attachment film placed on the another principal surface of the semiconductor substrate that is placed on a table provided with a plurality of heat-generating parts therein and rolling the roller on the attachment film while selectively causing the heat-generating parts to generate heat in response to a movement of the roller.
A manufacturing method of a semiconductor device, comprising the steps of:
- grinding another principal surface of the semiconductor substrate so as to thin the semiconductor substrate;
- applying an attachment film onto the another principal surface of the semiconductor substrate;
- and
- individualizing the semiconductor substrate into a plurality of semiconductor elements,
- wherein the attachment film is laminated on the semiconductor substrate by pressing by a rotatable roller the attachment film placed on the another principal surface of the semiconductor substrate that is placed on a table for supporting the semiconductor substrate and rolling the roller on the attachment film while moving a heat-generating part provided under the table in response to a movement of the roller, the heat-generating part generating heat while moving.
Dependencies are inferred from the claim text.