Integrated circuit packaging for improving effective chip-bonding area

A process for making an integrated circuit package comprising:

• providing a substrate having a chip-attaching surface;
• applying an A-stage liquid paste on the chip-attaching surface of the substrate;
• heating the substrate to transform the A-stage liquid paste into a B-stage film layer, the B-stage film layer having a glass transition temperature (Tg);
• attaching a chip to the chip-attaching surface of the substrate, the substrate is heated being higher than the glass transition temperature (Tg) of the B-stage film layer to make the B-stage film layer adhere the substrate and the chip, and the B-stage film layer being active without fully cured;
• electrically connecting the chip with the substrate having the B-stage film layer;
• and
• forming a molding compound on the chip-attaching surface of the substrate, the packing pressure for the molding compound being larger than the chip-attaching pressure in a manner that the B-stage film layer re-bonds the chip to improve effective chip-bonding area.

A process for making an integrated circuit package comprising:

• providing a substrate having a chip-attaching surface;
• printing a chip bond material on the chip-attaching surface of the substrate;
• partially curing the chip bond material on the substrate to be B-stage;
• attaching a chip to the chip-attaching surface of the substrate by the chip bond material;
• electrically connecting the chip and the substrate having the chip bond material in B-stage;
• and
• forming a molding compound and fully curing the chip bond material on the substrate to transform into C-stage.