Method of making electrode-to-electrode bond structure and electrode-to-electrode bond structure made thereby

A process of making an electrode-to-electrode bond structure, comprising the steps of:

• forming a resin coating on a first bonding object having a first electrode portion in a manner such that the resin coating covers the first electrode portion;
• forming an opening in the resin coating to expose the first electrode portion;
• forming a conductor in the opening;
• placing the first bonding object relative to a second bonding object having a second electrode portion in a manner such that the second electrode portion faces the conductor while the resin coating contacts the second bonding object;
• and
• bonding the first bonding object and the second bonding object by heat-treatment which causes the first electrode portion and the second electrode portion to be electrically connected with each other via the conductor while causing the resin coating to harden.

A process of making an electrode-to-electrode bond structure, comprising the steps of:

• forming a resin coating on a first bonding object having a first electrode portion in a manner such that the resin coating covers the first electrode portion;
• forming an opening in the resin coating to expose the first electrode portion;
• filling the opening with a bump forming material containing a metal;
• forming a bump at the opening by heating;
• placing the first bonding object relative to a second bonding object having a second electrode portion in a manner such that the second electrode portion faces the bump while the resin coating contacts the second bonding object;
• and
• bonding the first bonding object and the second bonding object by heat-treatment which causes the first electrode portion and the second electrode portion to be electrically connected with each other via the bump while causing the resin coating to harden.

A process of connecting a first bonding object and a second bonding object, the first bonding object being provided with a first electrode portion and a resin coating which has an opening for exposing the first electrode portion but otherwise covers the first bonding object, the second bonding object being provided with a second electrode portion corresponding to the first electrode portion, the process comprising the steps of:

• filling the opening with a metal paste containing a metal;
• placing the first bonding object relative to the second bonding object in a manner such that the first electrode portion faces the second electrode portion while the resin coating contacts the second bonding object;
• and
• bonding the first bonding object and the second bonding object by heat-treatment which causes the first electrode portion and the second electrode portion to be electrically connected with each other via the metal while causing the resin coating to harden.

A process of connecting a first bonding object and a second bonding object, the first bonding object being provided with a first electrode portion and a resin coating which has an opening for exposing the first electrode portion but otherwise covers the first bonding object, the second bonding object being provided with a second electrode portion corresponding to the first electrode portion, the process comprising the steps of:

• forming a conductor in the opening;
• placing the first bonding object relative to the second bonding object in a manner such that the first electrode portion faces the conductor while the resin coating contacts the second bonding object;
• and
• bonding the first bonding object and the second bonding object by heat-treatment which causes the first electrode portion and the second electrode portion to be electrically connected with each other via the conductor while causing the resin coating to harden.

A process of connecting a first bonding object and a second bonding object, the first bonding object being provided with a first electrode portion and a resin coating which has an opening for exposing the first electrode portion but otherwise covers the first bonding object, the second bonding object being provided with a second electrode portion corresponding to the first electrode portion, the process comprising the steps of:

• filling the opening with a bump forming material containing a metal;
• forming a bump at the opening by heating;
• placing the first bonding object relative to the second bonding object in a manner such that the second electrode portion faces the bump while the resin coating contacts the second bonding object;
• and
• bonding the first bonding object and the second bonding object by heat-treatment which causes the first electrode portion and the second electrode portion to be electrically connected with each other via the bump while causing the resin coating to harden.

A process of preparing an intermediate product used for making an electrode-to-electrode bond structure, comprising the steps of:

• forming a resin coating on a first bonding object having a first electrode portion in a manner such that the resin coating covers the first electrode portion;
• forming an opening in the resin coating to expose the first electrode portion;
• and
• forming a conductor in the opening;
• wherein the resin coating is hardenable by heating.

A process of preparing an intermediate product used for making an electrode-to-electrode bond structure, comprising the steps of:

• forming a resin coating on a first bonding object having a first electrode portion in a manner such that the resin coating covers the first electrode portion;
• forming an opening in the resin coating to expose the first electrode portion;
• and
• filling the opening with a bump forming material containing a metal;
• wherein the resin coating is hardenable by heating.

An electrode-to-electrode bond structure comprising:

• a first bonding object having a first electrode portion;
• a second bonding object having a second electrode portion facing the first electrode portion;
• an electric conductor having a intermediate constricted portion for connecting the first electrode portion and the second electrode portion;
• and
• a sealing resin sealing a gap between the first bonding object and the second bonding object.