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US 2004/0106230 A1Published application
Multi-die module and method thereof
AssigneeATI Technologies, Inc.
InventorsVincent Chan, Samuel Ho
Life of this patent
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Abstract
A multi-die module is electrically connected to both an unpackaged die and a packaged die as disclosed herein. The multi-die module has a footprint that is the same as conventional multi-die packages, which do not include packaged die, thereby allowing the multi-die module to be interchangeable with conventional multi-die packages. In one embodiment, the unpackaged die is a graphics processor, and the packaged die is a standard memory that has been burned in, functionally tested, and speed rated.
Claims40
A device comprising:
- a package module having a footprint size based on a standard package;
- an unpackaged semiconductor die directly attached to the package module;
- and
- a packaged semiconductor attached to the multi-die module.
1 more element
A device comprising:
- a package module sized to be interchangeable with standard package sizes;
- a graphics-processing die directly attached to the package module;
- and
- a packaged memory attached to the package module.
1 more element
A method comprising the steps of:
- directly attaching a first semiconductor die to a package substrate;
- forming electrical connections between the first semiconductor die and the package substrate;
- securing the electrical connections;
- placing a second semiconductor die in a die package;
- attaching the die package to the package substrate;
- and
- forming electrical connections between the die package and the package substrate.
4 more elements
Dependencies are inferred from the claim text.