Substrate based ESD network protection method for flip chip design
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorChau-Neng Wu
Life of this patent
Estimating the term…
Abstract
In accordance with the objectives of the invention a new method is provided for ESD protection of mounted flip chips. In a first embodiment of the invention, the Input/Output cells and power cells are provided with ESD protection that is connected to a dedicated bump pad. The substrate of the flip chip package interconnects all of the dedicated bump pads, completing the ESD network. Under the second embodiment of the invention, the Input/Output cells and power cells are provided with ESD protection that is connected to a dedicated bump pad, a last metal layer interconnects all of the dedicated bump pads, completing the ESD network.
Claims47
A method of creating an Electro Static Discharge (ESD) network for flip chip devices, comprising:
- providing a flip chip, the flip chip having been provided with at least one ESD circuit in or over the surface thereof;
- providing a first contact pad to the at least one ESD circuit in or over the surface of the flip chip;
- providing a second contact pad for an ESD mesh to the at least one ESD circuit in or over the surface of the flip chip;
- providing a substrate for mounting of a flip chip over the surface thereof, the substrate having been provided with interconnect metal in or over the surface thereof;
- providing a third contact pad in or over an ESD layer of the substrate, the third contact pad being aligned with the first contact pad;
- providing a fourth contact pad in or over the ESD layer of the substrate, the fourth contact pad being aligned with the second contact pad;
- providing an ESD mesh over the ESD layer of the substrate;
- and
- connecting the fourth contact pad with the ESD mesh.
A method of creating an Electro Static Discharge (ESD) network for flip chip devices, comprising moving ESD support from a flip chip to a flip chip mounting support.
A method of creating an Electro Static Discharge (ESD) network for flip chip devices, comprising:
- providing a flip chip, the flip chip having been provided with at least one ESD circuit in or over the surface thereof;
- providing a first contact pad to the at least one ESD circuit in or over the surface of the flip chip;
- providing a second contact pad for an ESD mesh to the at least one ESD circuit in or over the surface of the flip chip;
- providing a Printed Circuit Board (PCB) for mounting a flip chip over the surface thereof, the PCB having been provided with interconnect metal in or over the surface thereof;
- providing a third contact pad in or over an ESD layer of the PCB, the third contact pad being aligned with the first contact pad;
- providing a fourth contact pad in or over the ESD layer of the PCB, the fourth contact pad being aligned with the second contact pad;
- providing an ESD mesh over the ESD layer of the PCB;
- and
- connecting the fourth contact pad with the ESD mesh.
A method of creating an Electro Static Discharge (ESD) network for flip chip devices, comprising moving ESD support from a flip chip to a Printed Circuit Board (PCB).
An Electro Static Discharge (ESD) network for flip chip devices, comprising:
- a flip chip, the flip chip having been provided with at least one ESD circuit in or over the surface thereof;
- a first contact pad to the at least one ESD circuit provided in or over the surface of the flip chip;
- a second contact pad for an ESD mesh to the at least one ESD circuit provided in or over the surface of the flip chip;
- a substrate for mounting of a flip chip over the surface thereof, the substrate having been provided with interconnect metal in or over the surface thereof;
- a third contact pad provided in or over an ESD layer of the substrate, the third contact pad being aligned with the first contact pad;
- a fourth contact pad provided in or over the ESD layer of the substrate, the fourth contact pad being aligned with the second contact pad;
- an ESD mesh provided over the ESD layer of the substrate;
- and
- the fourth contact pad having been connected with the ESD mesh.
An Electro Static Discharge (ESD) network for flip chip devices, comprising:
- a flip chip, the flip chip having been provided with at least one ESD circuit in or over the surface thereof;
- a first contact pad to the at least one ESD circuit provided in or over the surface of the flip chip;
- a second contact pad for an ESD mesh to the at least one ESD circuit provided in or over the surface of the flip chip;
- a Printed Circuit Board (PCB) for mounting a flip chip over the surface thereof, the PCB having been provided with interconnect metal in or over the surface thereof;
- a third contact pad provided in or over an ESD layer of the PCB, the third contact pad being aligned with the first contact pad;
- a fourth contact pad provided in or over the ESD layer of the PCB, the fourth contact pad being aligned with the second contact pad;
- an ESD mesh over provided the ESD layer of the PCB;
- and
- the fourth contact pad having been connected with the ESD mesh.
Dependencies are inferred from the claim text.