Light emitting diode having an adhesive layer and a manufacturing method thereof
AssigneeEpistar Corporation
InventorsMin-Hsun Hsieh, Tzu-Feng Tseng, Wen-Huang Liu, Ting-Wei Yeh, Jen-Shui Wang
Life of this patent
Estimating the term…
Abstract
A method for forming a light emitting diode includes forming a first stack, forming a second reaction layer over the first stack, forming a second stack, forming a first reaction layer over the second stack, and holding together the first reaction layer and the second reaction layer by means of a transparent adhesive layer. The transparent adhesive layer is formed between the first and second reaction layer, therefore the second reaction layer of the first stack will not come off the first reaction layer of the second stack.
Claims22
A method for forming a light emitting diode comprising following steps:
- forming a first stack;
- forming a second reaction layer over said first stack;
- forming a second stack;
- forming a first reaction layer over saidsecond stack;
- holding together said first reaction layer and said second reaction layer by means of a transparent adhesive layer.
A light emitting diode comprising:
- a first stack;
- a second reaction layer formed on the first stack;
- a second stack;
- a first reaction layer formed on the second stack;
- a transparent adhesive layer formed between the first and second reaction layers;
- and
- a first electrode and a second electrode formed on the first stack.
Dependencies are inferred from the claim text.