Pattern-forming process using photosensitive resin composition
AssigneeHitachi Chemical Company, Ltd.
InventorsHideo Hagiwara, Makoto Kaji, Masataka Nunomura
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Abstract
There are disclosed a photosensitive resin composition which comprises (A) a polyamic acid having recurring units represented by the formula (I): 1 wherein R1 represents 2 and R2 represents a divalent organic group, and (B) an acryl compound having an amino group, and also a photosensitive resin composition for an i-line stepper which further comprises a photoinitiator in addition to the photosensitive resin composition.
Claims18
A photosensitive resin composition for i-line stepper using monochromatic light, which comprises (1) a polyimide precursor, formed from an oxydiphthalic acid or acid anhydride thereof as a reactant, a 20 μm film thickness of said polyimide precursor having a transmittance, at 365 nm, of at least 40%;
- (2) an addition-polymerizable compound;
- and (3) a photoinitiator.
A photosensitive resin composition which comprises (1) a polyimide precursor formed from an oxydiphthalic acid or acid anhydride thereof with a diamine, (2) an addition-polymerizable compound, and (3) a photoinitiator, and which is adapted to be exposed and developed using an i-line stepper which uses monochromatic light, the polyimide precursor being such that a 20 μm thick film thereof has a transmittance, at 365 nm, of at least 40%.
A photosensitive resin composition for i-line stepper using monochromatic light, which comprises (1) a polyimide precursor, formed from an oxydiphthalic acid or acid anhydride thereof with a diamine, (2) an addition-polymerizable compound and (3) a photoinitiator, the polyimide precursor being such that a 20 μm thick film thereof has a transmittance, at 365 nm, of at least 40%.
Dependencies are inferred from the claim text.