Thermoplastic film structures with a low melting point outer layer

A film structure comprising a base layer comprising a propylene polymer, an intermediate layer on one side of the base layer, the intermediate layer comprising an ethylene polymer, and a first outer layer extrusion-coated on a side of the intermediate layer opposite the base layer.

A method of manufacturing a coextruded, biaxially oriented film structure comprising a base layer comprising a polyolefin and a first outer layer comprising a polymer that has a melting point of not more than 230° F. (110° C.), wherein the method comprises the steps of:

• preparing and coextruding melts corresponding to each individual layer of the film structure through a die to form a coextruded film sheet;
• and
• simultaneously biaxially orienting the coextruded film sheet to form the film structure.

A method of manufacturing a coextruded, biaxially oriented film structure comprising a base layer comprising a polyolefin and a first outer layer comprising a polymer that has a melting point of not more than 230° F. (110° C.), wherein the method comprises the steps of:

• preparing and coextruding melts corresponding to each individual layer of the film structure through a die to form a coextruded film sheet;
• and—sequentially biaxially orienting the coextruded film sheet with a sequential biaxial orientation apparatus that employs a radiant-heated machine-direction orientation stretcher.

A film structure prepared as a substrate for an extrusion-coated outer layer, wherein the film structure comprises (i) a base layer comprising a propylene polymer and (ii) an additional layer on one side of the base layer comprising an ethylene polymer, wherein the additional layer is receptive to an extrusion-coated outer layer on a side of the additional layer opposite the base layer.

A coextruded, biaxially oriented film structure comprising a base layer comprising a thermoplastic polymer and a first outer layer comprising a thermoplastic polymer that has a Vicat softening point of not more than 85° C. (185° F.).