Wafer dicing/die bonding sheet
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsToshio Shiobara, Nobuhiro Ichiroku, Hideki Akiba, Masachika Yoshino
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Abstract
In a wafer dicing/die bonding sheet comprising a backing member, an adhesive layer, and a protective member, the adhesive layer is made of an adhesive composition comprising a phenolic hydroxyl radical-bearing polyimide resin, an epoxy resin, and an epoxy resin curing agent, the ratio of the total weight of the epoxy resin and the epoxy resin curing agent to the weight of the polyimide resin being from 0.1:1 to 3:1. Due to heat resistance, improved adhesive properties and a low modulus of elasticity, the wafer dicing/die bonding sheet is effective for reducing the warpage of a chip after die bonding.
Claims3
A wafer dicing/die bonding sheet comprising a backing member, an adhesive layer formed thereon, and a protective member for protecting the adhesive layer,
- said adhesive layer being made of an adhesive composition comprising a phenolic hydroxyl radical-bearing polyimide resin, an epoxy resin, and an epoxy resin curing agent, the ratio of the total weight of the epoxy resin and the epoxy resin curing agent to the weight of the polyimide resin being from 0.1:1 to 3:1.
Dependencies are inferred from the claim text.