Lamination process and structure of high layout density substrate
AssigneeVIA Technologies, Inc.
InventorsKwun Yao Ho, Moriss Kung
Life of this patent
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Abstract
A lamination process and structure of a high layout density substrate is disclosed. The lamination process comprises the following steps. First of all, a plurality of laminating layers are individually formed, wherein each laminating layer has a first dielectric layer, a plurality of first vias and a patterned conducting layer. Next, a bottom layer having a second dielectric layer and a plurality of second vias is formed. Then, the laminating layers and the bottom layer are stacked. Finally, the laminating layers and the bottom layer are laminated simultaneously to form a multiplayer substrate at one time.
Claims30
A simultaneous lamination process for forming a multiplayer substrate, at least comprising:
- (a) forming a plurality of laminating layers individually, wherein each said laminating layer has a dielectric layer with a first side and a second side, a patterned conductive layer positioned at the first side, and a plurality of first vias with a first ends and second ends positioned within the dielectric layer, wherein the first ends of the first vias connect with the patterned conductive layer and the second ends of the first vias are exposed by the dielectric layer at the second side;
- (b) forming a bottom layer having a second dielectric layer and a plurality of second vias penetrating the second dielectric layer;
- and
- (c) laminating said plurality of laminating layers and said bottom layer simultaneously to form the multiplayer substrate, wherein said bottom layer is disposed at a bottom side of the multiplayer substrate.
A simultaneous lamination process for forming a multiplayer substrate, at least comprising:
- (a) forming a plurality of laminating layers individually, wherein each said laminating layer has a dielectric layer with a first side and a second side, a patterned conductive layer positioned at the first side, and a plurality of first vias with a first ends and second ends positioned within the dielectric layer, wherein the first ends of the first vias connect with the patterned conductive layer and the second ends of the first vias are exposed by the dielectric layer at the second side;
- (b) providing a core substrate with a plurality of through holes therein;
- and
- (c) laminating said plurality of laminating layers and said core substrate simultaneously to form the multiplayer substrate.
A lamination multiplayer substrate, at least comprising:
- a plurality of laminating layers stacked and laminated together, wherein each said laminating layer has a dielectric layer with a first side and a second side, a patterned conductive layer positioned at the first side, and a plurality of first vias with a first ends and second ends positioned within the dielectric layer, wherein the first ends of the first vias electrically connect with the patterned conductive layer and the second ends of the first vias electrically connect with an adjacent said laminating layer;
- and
- a bottom layer stacked and laminated with the plurality of laminating layers and disposed at a bottom side of the multiplayer substrate, wherein said bottom layer has a second dielectric layer and a plurality of second vias penetrating the second dielectric layer and electrically connecting with the plurality of laminating layers, wherein said first dielectric layers and said second dielectric layer are bonded together.
A lamination multiplayer substrate, at least comprising:
- a core substrate having a plurality of through holes therein;
- and
- a plurality of laminating layers stacked and laminated with said core substrate, wherein each said laminating layer has a dielectric layer with a first side and a second side, a patterned conductive layer positioned at the first side, and a plurality of vias with a first ends and second ends positioned within the dielectric layer, wherein the first ends of the vias electrically connect with the patterned conductive layer and the second ends of the first vias electrically connect with one of an adjacent said laminating layer and said core substrate, wherein said first dielectric layers are bonded together.
Dependencies are inferred from the claim text.