Multi-channel laser pump source for optical amplifiers

Optical apparatus comprising:

• a first submount having a standoff structure protruding from a first surface thereof;
• an optical emitter chip bonded to said first submount, said optical emitter chip having a first optical emitter and contacting said standoff structure in a first plurality of contact portions of said standoff structure, said first plurality of contact portions including all points on said standoff structure which contact said emitter chip, at least three consecutive ones of said contact portions along a straight line being mutually isolated from each other along said straight line;
• and
• an integrated optics chip having a first optical receiver, said integrated optics chip being bonded to said first submount in such a way that said first optical receiver can receive optical energy emitted by said first emitter.

Optical apparatus comprising:

• a submount having a standoff structure protruding from a first surface thereof;
• an integrated optics chip bonded to said submount, said integrated optics chip having a first optical receiver and contacting said standoff structure in a first plurality of contact portions of said standoff structure, said first plurality of contact portions including all points on said standoff structure which contact said integrated optics chip, at least three consecutive ones of said contact portions along a straight line being mutually isolated from each other along said straight line;
• and
• an optical emitter chip having a first optical emitter, said optical emitter chip being bonded to said submount in such a way that said first optical receiver can receive optical energy emitted by said first emitter.

A mounting method for optical components, comprising the steps of:

• providing a submount having a standoff structure protruding from a first surface thereof;
• juxtaposing an optical emitter chip against the standoff structure such that said emitter chip contacts said standoff structure in a first plurality of contact portions of said standoff structure, said first plurality of contact portions including all points on said standoff structure which contact said emitter chip after said step of juxtaposing, at least three consecutive ones of said contact portions along a straight line being mutually isolated from each other along said straight line;
• bonding said emitter chip to said submount with a bonding agent which contacts said submount only in regions thereof other than on said first plurality of contact portions;
• and
• juxtaposing an integrated optics chip against said standoff structure such that a first optical receiver of said integrated optics chip can receive optical energy emitted by said first emitter.

A mounting method for optical components, comprising the steps of:

• providing a submount having a standoff structure protruding from a first surface thereof;
• juxtaposing an integrated optics chip against the standoff structure such that said integrated optics chip contacts said standoff structure in a first plurality of contact portions of said standoff structure, said first plurality of contact portions including all points on said standoff structure which contact said integrated optics chip after said step of juxtaposing, at least three consecutive ones of said contact portions along a straight line being mutually isolated from each other along said straight line;
• bonding said integrated optics chip to said submount with a bonding agent which contacts submount only in regions thereof other than on said first plurality of contact portions;
• and
• juxtaposing an optical emitter chip against said standoff structure such that a first optical receiver of said integrated optics chip can receive optical energy emitted by said first emitter.

A method for making an optical assembly, comprising the steps of:

• providing a first submount having a standoff structure protruding from a first surface thereof;
• pressing an optical array emitter chip against the standoff structure such that at least said emitter chip deforms and said emitter chip contacts said standoff structure in a first plurality of contact portions of said standoff structure, said emitter chip having a plurality of optical emitters;
• bonding said emitter chip to said first submount;
• juxtaposing against said standoff structure an optical fiber array having a plurality of optical fibers, such that a receiving end of each of said fibers can receive optical energy emitted by a respective one of said optical emitters, and
• bonding said integrated optics chip to said first submount.

Optical apparatus comprising:

• a first submount having a standoff structure protruding from a first surface thereof;
• an optical array emitter chip bonded to said first submount, said optical emitter chip having a plurality of optical emitters and contacting said standoff structure in a first plurality of contact portions of said standoff structure, said first plurality of contact portions including all points on said standoff structure which contact said emitter chip, at least three consecutive ones of said contact portions along a straight line being mutually isolated from each other along said straight line;
• and
• an optical fiber array having a plurality of optical fibers, said optical fiber array being bonded to said first submount in such a way that said a receiving end of each of said fibers can receive optical energy emitted by a respective one of said optical emitters.

Optical apparatus comprising:

• a submount having a standoff structure protruding from a first surface thereof;
• an integrated optics chip bonded to said submount, said integrated optics chip having a first optical receiver and contacting said standoff structure in a first plurality of contact portions of said standoff structure, said first plurality of contact portions including all points on said standoff structure which contact said integrated optics chip, at least three consecutive ones of said contact portions along a straight line being mutually isolated from each other along said straight line;
• and
• an optical emitter chip having a first optical emitter, said optical emitter chip being bonded to said submount in such a way that said first optical receiver can receive optical energy emitted by said first emitter.

A mounting method for optical components, comprising the steps of:

• providing a submount having a standoff structure protruding from a first surface thereof;
• juxtaposing an optical array emitter chip against the standoff structure such that said emitter chip contacts said standoff structure in a first plurality of contact portions of said standoff structure, said first plurality of contact portions including all points on said standoff structure which contact said emitter chip after said step of juxtaposing, at least three consecutive ones of said contact portions along a straight line being mutually isolated from each other along said straight line;
• bonding said emitter chip to said submount with a bonding agent which contacts said submount only in regions thereof other than on said first plurality of contact portions;
• and
• juxtaposing against said standoff structure an optical fiber array having a plurality of optical fibers, said optical fiber array being arranged such that receiving ends of each of said fibers can receive optical energy emitted by a respective optical emitter on said optical array emitter chip.

A mounting method for optical components, comprising the steps of:

• providing a submount having a standoff structure protruding from a first surface thereof;
• juxtaposing against the standoff structure an optical fiber array having a plurality of optical fibers, such that said optical fiber array contacts said standoff structure in a first plurality of contact portions of said standoff structure, said first plurality of contact portions including all points on said standoff structure which contact said optical fiber array after said step of juxtaposing, at least three consecutive ones of said contact portions along a straight line being mutually isolated from each other along said straight line;
• bonding said optical fiber array to said submount with a bonding agent which contacts said submount only in regions thereof other than on said first plurality of contact portions;
• and
• juxtaposing an optical array emitter chip against said standoff structure such that receiving ends of each of said fibers can receive optical energy emitted by a respective optical emitter on said optical array emitter chip.