Lead assemblies with offset portions and microelectronic assemblies with leads having offset portions

A lead assembly comprising:

• a connecting structure having a plurality of separable portions;
• a plurality of leads, each said lead having a first end, a second end, a lead axis defined by said first end and said second end, and an offset portion disposed between said first end and said second end;
• said offset portion being offset from said lead axis and adapted to be displaced downwardly with respect to a lead axis and bonded to a contact;
• each lead being connected to said connecting structure and separable from the assembly by severing at least one of said separable portions;
• and
• a bus element, said bus element interconnecting said separable portions.

A microelectronic component comprising:

• a dielectric layer having a slot defined therein and a lead assembly overlying said dielectric layer;
• said lead assembly comprising a plurality of leads, each said lead having an offset portion disposed between a first end and a second end, said offset portion being offset from a lead axis defined by said first end and said second end;
• a connecting structure, said connecting structure connected to said first ends of said leads and interconnecting said leads;
• and
• said lead assembly overlying said dielectric layer so that each offset portion is aligned with said slot.

A method of forming a microelectronic assembly comprising:

• providing a microelectronic component including a dielectric layer having a slot defined therein and a lead assembly overlying said dielectric layer, said lead assembly comprising a plurality of leads, each said lead having an offset portion, said offset portion located between a first end and a second end, said offset portion being offset from a lead axis defined by said first end and said second end, a connecting structure, said connecting structure connected to said first ends of said leads and including at least one separable portion interconnecting at least some of said leads;
• said lead assembly overlying said dielectric layer so that each offset portion is aligned with said slot;
• the microelectronic component including at least one aperture providing access to said at least one separable portion;
• assembling the microelectronic component with a microelectronic element so that a first face of the microelectronic element faces the microelectronic component;
• further including a plurality of contacts and connecting said offset portion of one of said leads to one of said plurality of contacts exposed at said first face;
• and
• severing the connecting structure at said at least one separable portion so as to isolate said lead connected to said contact from said lead assembly.