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US 2004/0105240 A1Published application
Multiple channel modules and bus systems using same
AssigneeRambus Inc.
InventorsBelgacem Haba, Richard E. Perego, David Nguyen, Billy W. Garrett JR., Ely Tsern, Craig E. Hampel, Wai-Yeung Yip
Life of this patent
Estimating the term…
Abstract
Various module structures are disclosed which may be used to implement modules having 1 to N channels. Bus systems may be formed by the interconnection of such modules.
Claims96
A module having first and second primary surfaces and having a first end, the module comprising:
- a first set of input finger connectors disposed on at least one of the first and second primary surfaces proximate to the first end;
- a first set of output finger connectors disposed on at least one of the first and second primary surfaces proximate to the first end;
- a second set of input finger connectors disposed on at least one of the first and second primary surfaces proximate to the first end;
- a second set of output finger connectors disposed on at least one of the first and second primary surfaces proximate to the first end;
- and
- a bus including a first channel extending from the first set of input finger connectors to the first set of output finger connectors and a second channel extending from the second set of input finger connectors to the second set of output finger connectors.
3 more elements
A bus system comprising:
- a motherboard including motherboard connectors and bus segments electrically coupling the motherboard connectors;
- and
- a plurality of modules arranged from a first module to a last module, wherein each of the plurality of modules includes a bus having a first channel and a second channel, the first channel connecting a first set of input finger connectors proximate to a first end to a first set of output finger connectors proximate to the first end and the second channel connecting a second set of input finger connectors proximate to the first end to a second set of output finger connectors proximate to the first end, the bus electrically coupled to one of the motherboard connectors, wherein each of the modules is mechanically coupled to one of the motherboard connectors.
A module comprising:
- a first printed circuit board having first and second primary surfaces and having a first end and a second end;
- at least one first integrated circuit (IC) populating at least one of the first and second primary surfaces;
- a set of finger connectors disposed on the first printed circuit board proximate to the first end;
- a first bus segment disposed on the first printed circuit board and coupled to the set of finger connectors and the at least one first IC;
- a conductive interconnect having a second bus segment, the conductive interconnect connected to the first printed circuit board proximate to the second end and adapted to mechanically connect to a second printed circuit board, the second bus segment electrically coupled to the first bus segment and capable of being electrically coupled to a third bus segment disposed on the second printed circuit board;
- and
- a bus comprising at least the first and second bus segments.
4 more elements
A bus system comprising:
- a motherboard including a motherboard connector and a first bus segment electrically coupled to the motherboard connector;
- and
- a module comprising:
- a first printed circuit board having first and second primary surfaces and having a first end and a second end;
- a set of finger connectors disposed on the first printed circuit board proximate to the first end, the finger connectors electrically connected to the motherboard connector;
- at least one first integrated circuit (IC) disposed on the first printed circuit board;
- a second bus segment disposed on the first printed circuit board and coupled to the set of finger connectors and the at least one first IC;
- and
- a conductive interconnect having a third bus segment, the conductive interconnect connected to the first printed circuit board proximate to the second end and adapted to mechanically connect to a second printed circuit board, the third bus segment electrically coupled to the second bus segment and capable of being electrically coupled to a fourth bus segment disposed on the second printed circuit board.
6 more elements
A module having first and second primary surfaces and having a first end, the module comprising:
- a plurality of integrated circuits (ICs) populating at least one of the first and second primary surfaces;
- a first set of input finger connectors disposed on at least one of the first and second primary surfaces;
- a second set of input finger connectors disposed on at least one of the first and second primary surfaces;
- a first terminator disposed on at least one of the first and second primary surfaces;
- a second terminator disposed on at least one of the first and second primary surfaces;
- a first bus including a first channel extending from the first set of input finger connectors to the first terminator, the first bus connected to a first IC of the plurality of ICs;
- and
- a second bus including a second channel extending from the second IC of input finger connectors to the second terminator, the second bus connected to a second IC of the plurality of ICs.
5 more elements
A bus system comprising:
- a motherboard including motherboard connectors and bus segments electrically coupling the motherboard connectors;
- a first module including a first ingress connector, a first egress connector, a first integrated circuit (IC), and a first channel, the first channel coupled to the first ingress connector, the first egress connector, and the first IC;
- a second module including a second ingress connector, a second egress connector, a second IC, and a second channel, the second channel coupled to the second ingress connector, the second egress connector, and the second IC;
- and
- a termination module including a first channel terminator and a second channel terminator, the first channel terminator coupled to the first channel of the first module through a first set of the motherboard connectors and the second channel terminator coupled to the second channel of the second module through a second set of the motherboard connectors.
2 more elements
A bus system comprising:
- a motherboard including motherboard connectors and bus segments electrically coupling the motherboard connectors, the motherboard connectors including a first ingress connector for a first module slot, a first egress connector for the first module slot, a second ingress connector for a second module slot, a second egress connector for the second module slot, a third ingress connector for a third module slot, and a fourth ingress connector for the third module slot, and the bus segments including a first bus segment coupled to the first ingress connector, a second bus segment routed so as to occupy a region of the motherboard located between the first ingress connector and the first egress connector and coupled to the second ingress connector.
A bus system comprising:
- a motherboard including motherboard connectors and bus segments electrically coupling the motherboard connectors;
- a first module including a first ingress connector, a first egress connector, a second ingress connector, and a first terminator, wherein the first ingress connector is electrically coupled to the first egress connector and the second ingress connector is electrically coupled to the first terminator;
- a second module including a third ingress connector, a second egress connector, a fourth ingress connector, and a second terminator, wherein the third ingress connector is electrically coupled to the second egress connector and the fourth ingress connector is electrically coupled to the second terminator;
- and wherein the first ingress connector, the first egress connector, the second ingress connector, the second egress connector, the third ingress connector, and the fourth ingress connector are coupled to the motherboard connectors and wherein a first set of the bus segments couple the first egress connector to the fourth ingress connector and a second set of the bus segments couple the second egress connector to the second ingress connector, thereby providing a first channel coupling the first ingress connector, the first egress connector, the fourth ingress connector, and the second terminator and a second channel coupling the third ingress connector, the second egress connector, the second ingress connector, and the first terminator
1 more element
A module having first and second primary surfaces and having a first end, the module comprising:
- a first integrated circuit (IC) populating at least one of the first and second primary surfaces;
- a first set of input finger connectors disposed on at least one of the first and second primary surfaces;
- a first set of output finger connectors disposed on at least one of the first and second primary surfaces;
- a second set of input finger connectors disposed on at least one of the first and second primary surfaces;
- a terminator disposed on at least one of the first and second primary surfaces;
- a first bus including a first channel extending from the first set of input finger connectors to the first set of output finger connectors, the first bus connected to the first IC;
- and
- a second bus including a second channel extending from the second set of input finger connectors to the terminator.
5 more elements
A module comprising:
- a printed circuit board;
- a first set of integrated circuits (ICs) mounted on the printed circuit board;
- a second set of ICs mounted on the printed circuit board;
- a first input connector disposed on the printed circuit board;
- and
- a first ingress bus coupled to the first input connector, the first ingress bus split into a first path and a second path, the first path coupled to the first set of ICs and the second path coupled to the second set of ICs, the first ingress bus having a first characteristic impedance and the first path and the second path having a combined effective impedance substantially equal to the first characteristic impedance.
3 more elements
Dependencies are inferred from the claim text.