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AssigneeSumitomo Bakelite Co., Ltd.
InventorsRyoichi Okada, Hitoshi Aoki, Yoshitaka Okugawa, Kensuke Nakamura, Shinichiro ltoh
Estimating the term…
In a process for producing an electronic part which comprises soldering (A) an electronic member having conductor portions I for electric connection having a solder layer or a solder bump (a solder portion) on a surface of a tip and (B) an electronic member to be connected having conductor portions II for electric connection arranged at positions corresponding to positions of conductor portions I by pressing (A) to (B) under heating via an adhesive layer, the solder portion is brought into contact with the adhesive layer, the solder portion is melted by heating at a temperature of or higher than a melting point of the solder, the soldering is conducted by pressing the melted solder portion, and the adhesive layer is cured. An electronic part is obtained in accordance with the process. Electric connection is surely achieved and a highly reliable electronic part can be obtained with excellent productivity.
A process for producing an electronic part which comprises soldering (A) an electronic member having conductor portions I for electric connection having a solder layer or a solder bump on a surface of a tip and (B) an electronic member to be connected having conductor portions II for electric connection arranged at positions corresponding to positions of conductor portions I for electric connection by pressing electronic member (A) to electronic member (B) under heating via an adhesive layer, the process comprising bringing at least the solder layer or the solder bump into contact with the adhesive layer, melting the solder layer or the solder bump by heating at a temperature of or higher than a melting point of a solder forming the solder layer or the solder bump, conducting the soldering by pressing the melted solder layer or the solder bump, and curing the adhesive layer.
Dependencies are inferred from the claim text.